Abstract: An apparatus for monitoring a plasma torch includes a dedicated photometer which produces a signal representative of the temperature of a quartz tube of the torch, which signal can be used to reduce the temperature thereof.

Abstract: This invention relates to overlay test measurement systems which are useful for testing lithographic instruments used in making microcircuits, which includes a single second-level pattern set in the middle of a checkerboard-like arrangement of first level patterns alternating with opaque patterns, the patterns being constructed and arranged so that if a second substantially identical cluster is imaged on the first cluster with the second level pattern of the second cluster aligned with any one of the first level patterns on the first cluster then the opaque patterns of the second cluster would be aligned with the other first level patterns on the first cluster thereby protecting them from exposure.According to a feature of the invention there is provided a method of making a test wafer of the type described as well as a method of testing the alignment of lithographic tools using the aforesaid test mask and test wafer.

Abstract: This invention relates to apparatus for effecting alignment and spacing control of a mask and wafer for use, for example, in x-ray lithography, which includes, in combination, two optical channels for effecting lateral and vertical alignment at two spaced alignment targets respectively on the element, two spaced position sensors located on a line which is oblique with respect to a line joining the two alignment targets, and linkage for maintaining the distances between the position sensors and the element equal one to the other.

Abstract: A composite objective lens for a particle beam lithographic system having deflection coils within the bore of the lens, a solenoidal excitation lens coil, a first set of two or more cylindrical pole pieces with a lens gap and a second set of cylindrical pole pieces arranged concentrically outside the first pole pieces but within the excitation lens coil. The second set of pole pieces is constructed of a high saturation material such as iron with a lens gap coextensive with the gap in the first set of pole pieces. The return flux from the deflection coils is carried by the inner cylindrical pole pieces only, while the flux generated by the lens coil is shared by both the inner and outer pole pieces. With this arrangement the linear relationship between the axial field strength and excitation current is maintained at all points along the axis of the lens, and saturation of the inner pole piece is avoided.

Abstract: Wafer alignment apparatus includes an aligner platform having defined thereon X and Y axes and a desired rotational orientation for a wafer. A first vacuum spinner is supported for rotation in the platform about the intersection of the X and Y axes and second and third spinners are provided displaced from the intersection of the axes. Two edge sensors, for sensing the desired wafer edge location at two points separated from each other, and edge or notch sensors for sensing rotational alignment of said wafer provide inputs to logic means which provide outputs to the vacuum spinners for carrying out a series of individual rotations to align the wafer.

Abstract: Disclosed is a wafer handling device for a sputtering system where wafers, used in the manufacture of integrated circuits, are placed in a loading chamber, removed from the loading chamber and conveyed by a conveying device through a transportation chamber where they are individually picked from the conveying device by the wafer handling device and placed on a rotating table within the system sputtering chamber to be sputter processed. Concurrently within the placing of one unprocessed wafer on the rotating table, a processed wafer is picked from the rotating table and placed on a second conveying device or the same conveying device which brought unprocessed wafers to the wafer handling device for return to the loading chamber to be removed from the sputtering system for further handling and processing.

Abstract: A lamp comprising a tubular quartz envelope having a mounting base compression fitted to one end thereof.

Abstract: In order to obtain shorter exposure time and to obtain a longer life in x-ray lithography apparatus, an x-ray target made of tungsten is utilized and the apparatus operated to generate the tungsten M-line, this line being at a wavelength which will be absorbed by the resist normally used in lithography. To develop the resist, which was initially designed for use in an electron beam lithography, a developing method is used in which an initial short development with a high concentration is first carried out followed by a longer, full development with a concentration which is approximately the lowest at which complete development will take place.

Abstract: Disclosed is a regulator circuitry (stabilizer) for controlling the output of an RF generator according to a programmable input signal. A power stage is responsive to the selected value of the programmable input signal to drive the RF generator at the desired power level. A forward power feedback control circuit monitors and controls the power output stage so that the desired RF output level is maintained at a constant level. In this particular mode of operation, RF output power is maintained constant and therefore independent of variations in gain due to temperature changes and other parameters which could effect the overall transfer function of said generator (and including mismatch of the generator into the load).

Abstract: A particle beam lithographic system and method using smaller address structure particle beam for generating masks for integrated circuit technology utilizing an electrostatic deflector system to sweep the beam in the serpentine path for increased throughput.

Abstract: A reusable electric overlay measurement base pattern includes a pair of current pads forming first and second pads adapted to be contacted by point contacts, a first conductor of controlled width extending between the first and second pads, a pair of voltage pads forming third and fourth pads suitable for contacting by point contacts, two second conductors extending from the third and fourth pads to the first conductor contacting the first conductor at a predetermined spacing, and a fifth pad disposed adjacent and spaced from said first conductor approximately at the midpoint between the two second conductors. This permits a second level conductor to be deposited extending between the fifth pad and said first conductor which, when perfectly aligned, will intersect the first conductor at its midpoint. The misalignment of the second level conductor can be detected by measurements using the five pads.

Abstract: Apparatus for plasma etching of semiconductor devices. A plasma chamber is inductively coupled to a source of A.C. power wherein the semiconductor devices are etched. Alternately, the semiconductor devices may be etched or stripped at a location downstream of the plasma chamber.

Abstract: Means and methods are provided for examining bills and detecting flaws therein, such as length and width variations, holes, tears and dog-ears or folded corners. Electrical signals are generated by light sensing circuits and compared with signals representing the standard physical characteristics of the bill to indicate deviations therefrom.

Abstract: A transducer assembly comprising an inner, primary, transducer having a pair of transducers fixed to a liner or cavity for providing the fluid compression sending and receiving signals for measuring the velocity and change of composition of fluid in the cavity which is being inspired and expired by a patient in a setting, such as in an intensive care unit of a hospital. The inner transducer is disposed in a heated housing to maintain the temperature of the inner transducer at a temperature above the saturation point of the fluid being measured and is further provided with (1) an acoustical absorber to prevent sound energy from the connection tubes, which connect the transducer assembly to endotracheal tubing, from adversely affecting fluid measurements and, (2) water absorbing material to prevent water, which might condense in the connecting tubing, from entering the inner transducer and affecting the fluid measurements.

Abstract: Means and methods are provided for controlling the geometry changes in a wafer or mask to permit patterns on the wafer to be matched with projected patterns from the mask. A sealed chamber is provided to receive the edges of the wafer or mask. Pressure is applied from a pressure source into the chamber against the edges of the wafer or mask uniformly in all directions to produce compressive strains until the desired wafer or mask geometry is obtained.

Abstract: An apparatus for prealigning a silicon wafer prior to transfer to a work station. The wafer is spun on an aligning platform by means of air jets emanating from holes disposed in the surface of the platform while simultaneously being stopped by means of a vacuum source communicating with the surface of the platform. Sensor means detect when the wafer is centered within a first predetermined tolerance to turn off the air jets and vacuum to stop the wafer. Control means responsive to the sensor means then center the wafer to within a second predetermined tolerance. The wafer is then transported to the work station for processing.

Abstract: Electrical connections to thin film coatings, especially useful in a fluid flowmeter, have a conductive coating pressed against a rigid, relatively long, connector bar by conductively coated pads of elastomeric material at a selected controlled pressure, with the electrical connections to the film coating being made through the bar and pads. Utilizing this method, localized high stress areas which cause damage to the thin film are avoided, and low current densities are accomplished by the controlled contact pressure over a large area of the film coating.

Abstract: A method of depositing refractory metal silicides in a sputtering system on one or more substrates in an environment which supports a glow discharge from a pair of targets at an energy level sufficient to co-sputter and deposit the material from the targets onto the substrate(s). The method includes either a RF high voltage to be applied to one of the targets, or a DC voltage in the presence of a magnetic field to be applied to both targets so as to deposit silicon, either doped or pure, and refractory metal, either doped or pure, as the case may be, to provide a thin film of doped refractory metal silicide on the substrate(s).

Abstract: An encoder for providing a conical array of temporally phased pulse beams. A pulse is inserted and continuously recirculated around an optical ring. The pulse is amplified during each circulation and a portion of the pulse is emitted at the end of each circulation. The encoder includes means for spatially separating each emitted pulse to provide a conical array of beams at a constant field angle relative to the optical axis of propagation.

Abstract: A method for determining the completion of removal by plasma etching of phosphorus doped silicon dioxide from an underlying substrate.