Patents Represented by Attorney Takeuchi & Takeuchi
  • Patent number: 6861849
    Abstract: The capacity measuring device comprises a transistor (40) formed on a silicon substrate and having a drain, source, and gate regions (41, 42, and 43), extension metals (51-54) to be connected to the regions, a guard electrode (55) surrounding the extension metal (53) for the gate region, measurement pads (61-64) electrically connected to the extension metals, the guard rings (61g-64g) surrounding the measurement pads and connected to the guard electrode (55). Accordingly, the infinitesimal capacity between any regions of the transistor in full scale is accurately measured by connecting the guard electrode (55) to a guard terminal of an infinitesimal capacity measuring apparatus for canceling the parasitic capacity.
    Type: Grant
    Filed: July 1, 2003
    Date of Patent: March 1, 2005
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Tadashi Chiba
  • Patent number: 6851968
    Abstract: An electrical connector for a flat type conductor comprises terminals (20) with contact portion brought into contact with the flat conductor (F) when the flat conductor moves to the the closed position, and a pressing member (40) rotatable between the open and closed positions, wherein each terminal includes a base (21) and a main arm (22) having a first arm portion (24) and a second arm portion (25), at least one of the first and second arm portions having a sub-arm portion (27 and 33). When the pressure member is moved to the closed position, the sub-arm portion is resiliently deformed about a joint portion between the sub-arm portion and the main arm so that a distal end of said sub-arm portion presses the flat type conductor.
    Type: Grant
    Filed: June 19, 2003
    Date of Patent: February 8, 2005
    Assignee: Hirose Electric Co., Ltd.
    Inventor: Kazuhisa Tsunematsu
  • Patent number: 6845227
    Abstract: A print medium feed system comprises a pair of first print medium feed members for feeding a print medium to a print section, a print medium detection section for detecting the print medium, a second print medium feed member for feeding the print medium to the first print medium feed members, and a control section for controlling the first and second print medium feed members. According to the detection by the print medium detection section, the second print medium feed member transports the print medium by a first predetermined distance in the feed direction, then, the first print medium feed members transport the print medium in the feed direction by a second predetermined distance in the feed direction, and then transport the print medium by a third predetermined distance in a backward direction opposite to the feed direction.
    Type: Grant
    Filed: November 28, 2003
    Date of Patent: January 18, 2005
    Assignee: Oki Data Corporation
    Inventors: Akinori Nishino, Totsuya Kitabatake, Hiroaki Ono, Yasuo Noda
  • Patent number: 6840681
    Abstract: A tandem type optical connector (11) includes at least one tandem type adaptor (13) having opposite plug engaging cavities (19) each receiving an optical cable connector (14, 14?) and a shield cover (20, 31) provided over the adaptor (13) and having at least one panel fixing member (21) to attach the optical connector (11) to a panel at an angle other than right angles with respect to the panel (12).
    Type: Grant
    Filed: September 16, 2002
    Date of Patent: January 11, 2005
    Assignee: Hirose Electric Co., Ltd.
    Inventors: Michitomo Shibutani, Isamu Inokoshi, Katsuya Ezawa
  • Patent number: 6840074
    Abstract: A cylindrical pipe which is excellent in heat transfer characteristic and has no accumulation of liquid, wherein a flat-shaped portion (2) along the pipe axis (L) is formed inside the cylindrical pipe (1) formed in corrugated shape. As a method for manufacturing said pipe, the present invention provides a pipe manufacturing method, wherein a thin-wall blank cylindrical pipe (P) is fed in increments of a prescribed distance, while being rotated at a definite speed, a roller die (85) being pressed against the outer periphery of the cylindrical pipe, the roller die being advanced and retracted in accordance with the feed of the cylindrical pipe, for forming a spiral corrugation such that the groove depth thereof is gradually increased, starting from the flat portion of the cylindrical pipe, and reaches a maximum in the portion opposed to the flat one.
    Type: Grant
    Filed: March 11, 2003
    Date of Patent: January 11, 2005
    Inventors: Tojo Kamino, Masaji Nukuto
  • Patent number: 6840806
    Abstract: An electrical connector comprises a housing (12) and a substantially rectangular case (13) made of a metal and enclosing the housing. The rectangular case includes at least one connection portion (28) on a side of a lower surface thereof for connection with a circuit board, a resilient lock piece (20) and a pair of shield pieces (26) between the upper and lower surfaces the rectangular case for engaging a mating connector. The upper surface of the case is made flat for easy assembling with the housing. The resilient lock piece has a bending portion (21), which is bent toward an inner of the rectangular case and the shield pieces are provided on sides of the resilient lock piece.
    Type: Grant
    Filed: December 9, 2003
    Date of Patent: January 11, 2005
    Assignee: Hirose Electric Co., Ltd.
    Inventor: Akihiro Kodama
  • Patent number: 6819889
    Abstract: An image forming apparatus having a fuser with heater for fusing a toner image formed on a print medium stops the supply of electric power to the heater when a print controlling unit detects the end of printing information, thus reducing the power consumption and preventing early degradation of the heater.
    Type: Grant
    Filed: February 24, 2003
    Date of Patent: November 16, 2004
    Assignee: Oki Data Corporation
    Inventor: Masanori Okuda
  • Patent number: 6817868
    Abstract: An intermediate board electrical connector comprises a circuit board having two non-parallel straight edges, a plurality of connections sections (12 and 13) arranged along the straight edges at regular intervals, and a plurality of wiring conductors (14) connecting the corresponding connection sections (12 and 13). The connection sections (12 and 13) are connected to connectors (20 and 30), respectively.
    Type: Grant
    Filed: October 21, 2002
    Date of Patent: November 16, 2004
    Assignee: Hirose Electric Co., Ltd.
    Inventors: Tsutomu Matsuo, Tatsuya Arai
  • Patent number: 6818098
    Abstract: After the fixing of an angle indexing body to a holder by fixtures is canceled by loosening the fixtures, a resonator is turned by operating the angle indexing body with an axis in a vibration transmission direction as the center of rotation, a bonding work face is replaced by another bonding work face, and the angle indexing body is fixed to the holder by the fixtures so that the new bonding work face becomes parallel to the top face of a mounting table. Therefore, the replacement of the bonding work face can be simplified. Since overlapped workpieces are sandwiched between the bonding work face of the resonator and the mounting table, the mounting table makes a follow-up movement by a bearing composed of a spherical projection portion and a spherical depression portion to ensure that the bonding work face becomes parallel to the top face of the mounting table, thereby making it possible to optimize the position of the sandwiched workpieces.
    Type: Grant
    Filed: October 2, 2003
    Date of Patent: November 16, 2004
    Assignee: Ultex Corporation
    Inventors: Shigeru Sato, Seiya Nakai
  • Patent number: 6815260
    Abstract: A method of making a semiconductor device comprises the steps of coating a first face of an insulative board (1) with a thermally plastic resin (2), bonding at least one semiconductor element (3) onto the thermally plastic resin (2), piercing the thermally plastic resin (2) and the insulative board (1) with at least one capillary that holds a metal wire (4), forming a metal ball (4b) and pulling out the capillary from the insulative board (1) and the thermally plastic resin (2), pressing the capillary onto an electrode (3a) of the semiconductor element (3) and cutting off an extra wire, and attaching at least one metal bump (6) to the second face of the insulative board (1) so as to be connected to the metal ball (4a).
    Type: Grant
    Filed: May 24, 2002
    Date of Patent: November 9, 2004
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Yoshihiko Ino
  • Patent number: 6799630
    Abstract: A tube for a heat exchanger which has beads (21) formed on a brazing sheet (B) for configuring a tube (2) and tops of the beads brazed with opposed portions within a tube part (20) and a method for manufacturing the tube. The tube part (20) prior to brazing is determined to have a thickness (t′) larger than a predetermined thickness (t) and compressed in a direction of its thickness when it is brazed, and the tube which has tops of the beads crushed against or lodged in opposed portions within the tube part. Also a method for manufacturing the tube which can braze the tops of the beads with the opposed portions within the tube more securely and firmly than before.
    Type: Grant
    Filed: February 24, 2000
    Date of Patent: October 5, 2004
    Assignee: Zexel Corporation
    Inventors: Soichi Kato, Muneo Sakurada, Shin Kurihara, Sadao Haiya, Takashi Sugita, Shoji Akiyama, Takahumi Umehara
  • Patent number: 6790695
    Abstract: A method of manufacturing a semiconductor device capable of reducing the manufacturing cost and preventing the yield-down caused by etching process comprises the steps of forming a separation layer 120 and an epitaxial film 130 carrying LEDs 130c on a substrate 110, forming a protection layer 150 on the epitaxial film, forming etching grooves by etching a region of the epitaxial film, which is not covered by the protection layer, etching the separation layer to make discrete epitaxial films 130a, and adhering the discrete epitaxial films 130a onto the surface of a silicon substrate 170.
    Type: Grant
    Filed: November 20, 2003
    Date of Patent: September 14, 2004
    Assignee: Oki Data Corporation
    Inventors: Mitsuhiko Ogihara, Hiroyuki Fujiwara
  • Patent number: 6786307
    Abstract: A parking brake device which can not only better the safety, but also reduce the cost by simplifying the construction. A shock absorbing portion 35, 36 which resists an operating force in pulling a brake lever 30 toward the compartment and which is deformed by an impact force in the direction which is approximately opposite to the direction of pulling the brake lever 30 toward the compartment, absorbing the impact force is provided.
    Type: Grant
    Filed: August 13, 2002
    Date of Patent: September 7, 2004
    Assignees: Honda Giken Kogyo K.K., Otsuka Koki K.K.
    Inventors: Masahiko Komatsubara, Hiroki Ishikawa, Masahiro Imamachi, Satoru Masuda, Shingo Hori, Hiroshi Tsukamoto, Tomoya Sugiyama