Abstract: A method for cleaning and rinsing wafers used in the production of integrated circuits is disclosed. The wafers are submerged in a tank containing deionized water and the method includes repeated cycles comprising the steps of (1) introducing deionized water into the filled tank for a preset period of time to create an upward flow of water in the tank and about the wafers, with the outflow of water flowing over the top edges of the tank, (2) partially draining the tank to a level just above the upper edges of the wafers, and (3) refilling the tank with fresh deionized water. The number of cycles can be repeated a preset number of times or the quality of the water in the tank can be monitored, with the cycles being repeated until a preset quality of water is achieved in the tank.