Abstract: A power MOSFET suitable for use in RF applications and a method for making the same is disclosed. The power MOSFET reduces the gate coverage of the drain region of the device in order to decrease the device gate to drain capacitance Cgd. A significant portion of the gate overlaying the drain region is eliminated by the removal of a portion of a polysilicon layer that is disposed over a substantial portion of the drain region that resides between the channel portions of the body regions of the device. The resulting open area, that is subsequently covered by an oxide layer, separates the polysilicon gate electrodes of the device. Finally, a metal layer is deposited over the entire structure to form the gate and source electrodes of the device.

Abstract: The present invention utilizes a cache which stores various decoded instructions, or parcels, so that these parcels can be made available to the execution units without having to decode a microprocessor instruction, such as a CISC instruction, or the like. This increases performance by bypassing the fetch/decode pipeline stages on the front end of the microprocessor by using a parcel cache to store previously decoded instructions. The parcel cache is coupled to the microprocessor fetch/decode unit and can be searched during an instruction fetch cycle. This search of the parcel cache will occur in parallel with the search of the microprocessor instruction cache. When parcel(s) corresponding to the complex instruction being fetched are found in the parcel cache a hit occurs and the corresponding micro-ops are then sent to the execution units, bypassing the previous pipeline stages.

Abstract: A semiconductor device includes an emitter region, a contact region, and a resistive medium. The resistive medium is connected between the contact region and the emitter region. The contact region and the emitter region each include an edge facing each other. At least a portion of the emitter region edge and at least a portion of the contact region edge are non-parallel relative to each other. This configuration enables an emitter ballast resistance to be provided with varied emitter current flow along the injecting edge of the emitter. Furthermore, by including an additional contact and an additional resistive medium between the contacts, the ballast resistance of the semiconductor device can be increased without decreasing the figure of merit of the device.

Abstract: A sense amplifier circuit for reading and verifying the contents of non-volatile memory cells in a semiconductor integrated device including a memory matrix of electrically programmable and erasable cells. The circuit includes a sense amplifier which has a first input connected to a reference load column incorporating a reference cell, and a second input connected to a second matrix load column incorporating a cell of the memory matrix. The circuit also includes a small matrix of reference cells connected, in parallel with one another, in the reference load column. Also provided is a double current mirror having a first mirror column which is connected to a node in the reference load column connected to the first input, and a second mirror column coupled to the second matrix load column to locally replicate, on the second mirror column, the electric potential at the node during a load equalizing step.

Abstract: A method is provided for making conductive structures whereby an insulating layer is formed over a substrate. A conductive layer is then formed over the insulating layer. A first photoresist layer is formed over the conductive layer, patterned and developed. The conductive layer is etched after which the first photoresist layer is removed. A second photoresist layer is formed over the integrated circuit, patterned and developed. The remaining regions of the conductive layer forming an interconnect or a gate are partially etched to form two-tiered stepped sidewalls.