Patents Represented by Attorney, Agent or Law Firm Theodore E. Glanthay
  • Low temperature aluminum reflow for multilevel metallization
    Patent number: 6215188
    Abstract: The present invention provides a method for minimizing voids in a plug. The process begins by forming a conformal barrier layer within the hole and then forming a metal plug within the hole. Thereafter, a cap layer is formed over the metal plug in which the cap layer has a lower thermal expansion coefficient than the metal plug. The hole is heated such that the metal in the hole flows to eliminate the void as a result of the compressive stress generated by the cap layer on the metal plug.
    Type: Grant
    Filed: December 3, 1997
    Date of Patent: April 10, 2001
    Assignee: STMicroelectronics, Inc.
    Inventor: Melvin Joseph DeSilva