Abstract: A wafer processing system which requires no isolation between the operational areas within the processing system. The system of the present invention includes operational areas, such as a loading area, a transport area, and a reactor or thermal processing area. Advantageously, since there are no isolation devices or gate valves separating the areas, the processing system effectively has each operational area combined into a “single” chamber. Preferably, the single chamber has a single slit valve, hinge door, or other vacuum sealable door disposed proximate to the loading area to allow for the removal/insertion of the wafers into the loading area. Once the door to the loading area has been closed the internal pressure within the chamber can be kept uniform throughout each operational area.

Abstract: A system and method for using a portable enclosure system for conducting on-site demonstrations of semiconductor processing operations or as a temporary clean room. A vehicle transports an environmentally-controlled enclosure including a semiconductor processing workspace, preparation area, and entrance area, from a first location to a second location. An air suspension device and trailer are included in one embodiment. Air suspension devices and an enclosed truck are included in another embodiment. In yet another embodiment, the environmentally-controlled enclosure system includes a viewing mechanism, which allows for visual inspection of the internal portion of the enclosure from outside of the controlled environment, especially advantageous during demonstrations.

Abstract: A shelf assembly and system, which reduces the potential for accidental disruption of service or damage to neighboring transmission elements in a telecommunications network. The present invention operates to guide the transmission elements or fiber cables to and/or from a mounting position, and in or out from either side of electrical and/or optical telecommunications equipment. Fiber cables coupled at the mounting positions can be directed through reversible and removable fiber channels. Each fiber channel has a smooth surface and a radius of curvature, which provides an appropriate bend radius for guiding, routing, or bending the fiber cables into a fiber trough.

Abstract: An infant positioning device which provides the ability to move an infant, a preterm infant, and/or a newborn between and including a supine, prone, or side-lying position, with little or no tactile stimulation of the infant caused by human touch.

Abstract: A positionable arm composed of multiple member segments connected by an adjustable joint which may be fixedly positioned and repeatedly repositioned. The first member includes an end portion defining a first connector opening and an inner surface defining a chamber. A slideable piston provided in the first member includes a first end and a second end, the first end being adjacent the chamber and creating a seal along the inner surface of the first member. A rotatable connector is received in the first member between the second end of said piston and the end portion of the first member, and a second member is attached to the rotatable connector. To position the arm, a pressurized fluid source supplies compressed air to the chamber, which presses the piston against the rotatable connector, fixedly clamping the connector between the piston and the end portion of the first chamber.

Abstract: A heating apparatus for isothermally distributing a temperature across a semiconductor device or wafer during processing. The invention includes a chamber configured to receive a single semiconductor wafer. Housed within the chamber is a heating member or heating plate. Disposed on a periphery of the heating member is a heat source. Heat energy radiating from the heat source conducts through the heating member to create an isothermal temperature distribution across the heating member. Wafer supports are included on the heating plate which support the wafer in close proximity to the heating plate, such that the temperature of the heating plate establishes the temperature of the wafer. Advantageously, this configuration permits the temperature to be uniformly and isothermally distributed over the wafer.

Abstract: A structure wherein a hand held computer module can be conveniently and interchangeably coupled to accessory devices. The hand held computer module is detachably connected to a first accessory module by a first interlocking structure. The computer module includes the first interlock mechanism and the first accessory module includes the second interlock mechanism. The first and second interlock mechanisms are mated together to form a physical connection between the computer module and the first accessory module. The first accessory module also includes a third interlock mechanism which is similar to the first interlock mechanism. A second accessory module has a fourth interlock mechanism which is similar to the second interlock mechanism. The first accessory module can be detachably connected to a second accessory module by means of a second interlocking structure which includes the third and fourth interlock mechanisms.

Abstract: An improved CVD process, preferably a PECVD process, for forming a low-dielectric-constant insulating material on a semiconductor substrate, or on and/or under a metal barrier, or etch stop layer of SiNx, Ta(N), TiN, WNx and others. Specifically, the improved PECVD process provides for deposition of an N2O+SiF4+SiH4 based FSG film having improved characteristics, which may be accomplished in any conventional PECVD chamber, but preferably in a dual frequency PECVD chamber.

Abstract: A catheter for injecting medication to a specific point within a patient comprises a drug delivery lumen extending from a proximal end of the catheter to an injection port. The catheter comprises a mechanism for angularly pushing the injection port outwardly away from the body of the catheter into an artery wall so that medication can be injected directly into the artery wall.

Abstract: A semiconductor processing system and method, which uses heat energy typically wasted in most common semiconductor processing systems, to generate power. The present invention includes a heat management system, which uses the waste heat and/or the excess heat generated by a thermal-processing chamber, to generate a current from a first thermoelectric device. The current from the first thermoelectric device is then delivered to a second thermoelectric device. The second thermoelectric device, driven by the current from the first thermoelectric device, can be used to remove heat from a cooling chamber or else add heat to another processing chamber.

Abstract: A package includes a substrate mechanically supporting circuitry. A conductive cover (e.g., a metal sheet) is over the circuitry so that the circuitry is exposed below an opening in the conductive cover. A bent down corner of the conductive cover is inserted into a hole in the substrate. A solder ball is placed on the other end of the hole. During a subsequent heating, the solder ball is drawn up through the hole. When cooled, the conductive material grasps onto the tip of the bent down corner, thereby establishing a good connection between the conductive cover and the newly formed conductive via. As a finger approaches the circuitry (e.g., a fingerprint detection circuit), the finger first discharges electrostatic charge into the cover, not into the circuit, thereby protecting the circuit. In another package, the cover is composed of a highly resistive material, to slowly dissipate the electrostatic charge.

Abstract: A heating apparatus, system, and method for isothermally distributing a temperature across a semiconductor device during processing. The present invention provides a furnace assembly, which includes a processing chamber configured to removably receive a plurality of semiconductor wafers. The invention includes a first heating circuit and a second heating circuit. In accordance with the present invention, the first heating circuit provides a variable temperature, which may be controlled during processing. The second heating circuit provides a constant temperature. The temperature of the first heating circuit can be adjusted to keep the process chamber temperature at the constant and uniform level provided by the second heating circuit. The wafer carrier is positioned vertically within the processing chamber using an actuation mechanism. After the wafers are processed, the actuation mechanism is used to remove the wafer carrier from the process chamber.

Abstract: An apparatus for converting thermal energy to mechanical motion including a frame mounted onto an axle above a heat source. A flow circuit including at least three elongate chambers connected by fluid conduits is mounted onto the frame, and one-way valves provided in the flow circuit permit one-way fluid flow within the flow circuit. The heat source heats a motive fluid contained within the chambers beyond its boiling point, which increases the vapor pressure within the heated chamber, thereby forcing fluid out of the chamber and into the chamber immediately downstream in the flow circuit. The increased weight of the downstream chamber creates a torque about the axle, rotating the frame in an upstream direction.

Abstract: A mechanism on which cables, wires, and leads may be secured.The mechanism includes a bar assembly, which has a hollow member in telescopic engagement with an insertable member. Preferably, the insertable member slides in and out of the hollow member, so that a dimension of the bar can be varied. The bar assembly of the present invention also includes telescopically engaged end members, one at each end of the mechanism. A length of the end members can be varied, such that the depth of the mechanism may be varied.

Abstract: An adapter used in conjunction with voltage modules to provide multiple and variable DC output voltages. The adapter may include a circuit for stepping down an AC input voltage to lower AC output voltages. A voltage module is provided having an interface bus, configured to be coupleable to a distribution bus on the voltage adapter. Preferably, the voltage module includes AC-DC conversion circuitry, such that the AC output voltages received from the adapter may be converted to DC voltages. Once the adapter and voltage module are coupled together, the voltage module allows the user to select among the multiple DC output voltages provided. In some embodiments, the adapter includes additional circuitry for converting the stepped-down AC voltages into DC output voltages. Additional separate voltage modules may be coupled to the first voltage module, in series, to form a modular stack of voltage modules. Like the first voltage module, the second voltage module may have a selectable output voltage, as well.

Abstract: A thermal and moisture barrier device for use with a specialized heating and humidifying apparatus in the care of extremely premature neonatal infants. The thermal and moisture barrier comprises a collapsible and substantially flexible cover which defines an enclosed volume, large enough to accommodate an extremely premature neonatal infant. At least one flexible opening is located on a portion of the cover which communicates with the enclosed volume. A diaphragm provides closure of the flexible openings. The diaphragm is a resiliently flexible sheet extending across the opening and has slits.

Abstract: A swaging tool for use in swaging axially swaged fittings for joining together pipes. The present invention provides a radially balanced axial force, for uniformly pushing a ring of an axially swaged fitting over a sleeve, to swage the fitting to the pipe. The swaging tool of the present invention includes a tubular housing, having an inner surface, which defines a bore. The bore is configured to receive a pipe section having an axially swaged fitting placed thereon in preparation for swaging. Preferably, the housing may be split lengthwise into two opposed sections, such that when the two sections are brought together, the sections completely surround a portion of the pipe section and the fitting. Each housing section is provided a plurality of pusher assemblies, each pusher assembly may preferably be connected to a source of hydraulic pressure, which when activated moves the pusher assembly axially to provide the axial force necessary for swaging the fitting.