Patents Represented by Attorney, Agent or Law Firm Thomas L. Warden
  • Patent number: 6647310
    Abstract: An apparatus and method for controlling temperature during pre-delivery testing of microprocessors and integrated circuits wherein a testing package, including a thermally conductive lid overlying and in thermal contact with the microprocessor or integrated circuit, is covered by a block of thermally conductive material of predetermined thickness T, where T is a function of a desired temperature profile and, optionally, the current drawn by the microprocessor undergoing testing.
    Type: Grant
    Filed: May 30, 2000
    Date of Patent: November 11, 2003
    Assignee: Advanced Micro Devices, Inc.
    Inventors: John Yi, Fu-Weng Tea