Patents Represented by Attorney Thomson, Moser & Patterson

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  • Method and apparatus for substrate polishing
    Patent number: 6841057
    Abstract: A method and apparatus are provided for polishing a substrate surface. In one aspect, an apparatus for polishing a substrate includes a conductive polishing pad and an electrode having a membrane disposed therebetween. The membrane is orientated relative the conductive pad in a manner that facilitates removal of entrained gas from electrolyte flowing towards the conductive pad. The apparatus may be part of an electro-chemical polishing station that may optionally be part of a system that includes chemical mechanical polishing stations.
    Type: Grant
    Filed: March 13, 2002
    Date of Patent: January 11, 2005
    Assignee: Applied Materials Inc.
    Inventors: Ralph Wadensweiler, Alain Duboust, Liang-Yuh Chen, Manoocher Birang, Ratson Morad, Paul D. Butterfield