Patents Represented by Attorney Timohy M. Honeycutt

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  • Semiconductor chip with crack deflection structure
    Patent number: 8124448
    Abstract: Various die crack deflection structures and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes fabricating a semiconductor chip including an outer edge, a first side and a second side opposite to the first side. A deflection structure is fabricated in the semiconductor chip. The deflection structure includes a sloped profile to deflect a crack propagating in the semiconductor chip toward the first side or the second side of the semiconductor chip.
    Type: Grant
    Filed: September 18, 2009
    Date of Patent: February 28, 2012
    Assignee: Advanced Micro Devices, Inc.
    Inventor: Russell Hudson