Patents Represented by Attorney, Agent or Law Firm Todd Li
  • Method of forming a crack stop structure and diffusion barrier in integrated circuits
    Patent number: 6383893
    Abstract: A method for forming a crack stop structure and a barrier to the diffusion of oxygen and water vapor in integrated circuits is provided.
    Type: Grant
    Filed: December 28, 2000
    Date of Patent: May 7, 2002
    Assignee: International Business Machines Corporation
    Inventors: Edward S. Begle, Richard P. Volant, Kevin S. Petrarca