Abstract: A head worn device for feeding solder wire from a spool during a soldering operation while using a soldering iron. The device includes a semi-flexible tube that has one end portion mounted on the head worn device. A rotatable spool of wire solder is affixed to the head worn device near the mounted end of the tube. The wire solder is ducted through the tube to the opposite end which is open so that a short length of solder can be exposed. Therefore, the operator can apply the wire solder during a soldering operation while keeping both hands free to handle the soldering iron and position the workpiece or component.