Abstract: A multi-layer board is fabricated by plating up conductive posts on a nonconductive layer. The tops of the posts are planarized, resulting in sharp corners. The posts are aligned with a template, which has a hole above each post, and a second nonconductive layer is placed between the top of the posts and the bottom of the template. The two layers are laminated together by compressing the second layer between the first layer and the template, and the posts punch through the second layer. Conductive traces may then be etched or deposited between the posts tops, and the process may be repeated as many times as desired.