Abstract: The present invention is an apparatus for polishing a precision screw. The apparatus uses abrasive in a sealed container for polishing. Hence, the present invention can do precise polishing to obtain smooth surface of thread by removing tiny burrs with the abrasive.

Abstract: A telecommunication socket structure including a rigid housing defining an internal cavity and at least one resilient arm disposed in the cavity near an opening thereof. The resilient arm has a free end formed with a first and a second projecting sections which are adjacent to each other. The first and second projection sections are respectively positioned in forward and backward positions in the cavity. The surfaces of the first and second projection sections are respectively inward and outward inclined. In case an incorrect smaller telecommunication plug is inserted into the socket, a straight stopper section of the first projecting section facing outward will stop the plug from entering the socket. When a correct larger telecommunication plug is inserted into the socket, along the outward inclined face of the second projecting section, the plug will gradually press the second projecting section to bias the free end of the resilient arm to outer side of the cavity.

Abstract: An ornament card which is formed into a shape with a punch machine; one side of the card has a guide slot, of which the width is larger than the thickness of the card; a clamp slot having a width equal to the thickness of the card is furnished inside the guide slot; the inner end of the guide slot has a small round hole; a shoulder is furnished between the clamp slot and the guide slot; two cards can be connected together by means of the elongate guide slots; the clamp slots are used for fastening the cards in place, while the small round hole can provide a buffer function; after two cards are connected together, they would not separate from each other upon being pushed by a reverse force.

Abstract: A multi-chip package with a LOC lead frame is disclosed. Such a LOC lead frame has a plurality of leads, with each lead being divided into an inner portion and an outer connecting portion. A first tape adhering under the inner portions of the leads fastens the first chip and the first bonding wires electrically connect the first chip with the inner portions. A second tape adhering upon the inner portions of the leads fastens the second chip and the second bonding wires electrically connect the second chip with the inner portions. The second tape has a thickness so as to avoid the first bonding wires touching the second chip. The multi-chip package enables to package at least two chips by a LOC lead frame without turnover action during wire-bonding.