Abstract: This disclosure relates to a programmable wideband, LC Tuned, Voltage Controlled Oscillator with continuous center frequency select, and independent configuration of amplitude and tuning gain. The programmability can be via on chip non-volatile memory, or through data shifted into the part and stored via a data bus.
Abstract: A Three-Dimensional Structure (3DS) Memory allows for physical separation of the memory circuits and the control logic circuit onto different layers such that each layer may be separately optimized. One control logic circuit suffices for several memory circuits, reducing cost. Fabrication of 3DS memory involves thinning of the memory circuit to less than 50 ?m in thickness and bonding the circuit to a circuit stack while still in wafer substrate form. Fine-grain high density inter-layer vertical bus connections are used. The 3DS memory manufacturing method enables several performance and physical size efficiencies, and is implemented with established semiconductor processing techniques.
Abstract: A Three-Dimensional Structure (3DS) Memory allows for physical separation of the memory circuits and the control logic circuit onto different layers such that each layer may be separately optimized. One control logic circuit suffices for several memory circuits, reducing cost. Fabrication of 3DS memory involves thinning of the memory circuit to less than 50 ?m in thickness and bonding the circuit to a circuit stack while still in wafer substrate form. Fine-grain high density inter-layer vertical bus connections are used. The 3DS memory manufacturing method enables several performance and physical size efficiencies, and is implemented with established semiconductor processing techniques.
Abstract: The Vertical System Integration (VSI) invention herein is a method for integration of disparate electronic, optical and MEMS technologies into a single integrated circuit die or component and wherein the individual device layers used in the VSI fabrication processes are preferably previously fabricated components intended for generic multiple application use and not necessarily limited in its use to a specific application. The VSI method of integration lowers the cost difference between lower volume custom electronic products and high volume generic use electronic products by eliminating or reducing circuit design, layout, tooling and fabrication costs.
Abstract: A substantially temperature-independent LC-based oscillator is achieved using an LC tank that generates a tank oscillation at a phase substantially equal to a temperature null phase. The temperature null phase is a phase of the LC tank at which variations in frequency of an output oscillation of the LC-based oscillator with temperature changes are minimized. The LC-based oscillator further includes frequency stabilizer circuitry coupled to the LC tank to cause the LC tank to oscillate at the phase substantially equal to the temperature null phase.
Type:
Grant
Filed:
August 21, 2009
Date of Patent:
December 6, 2011
Assignee:
Si-Ware Systems Inc.
Inventors:
Bassel Hanafi, Sherif Hosny, Ayman Ahmed
Abstract: A Three-Dimensional Structure (3DS) Memory allows for physical separation of the memory circuits and the control logic circuit onto different layers such that each layer may be separately optimized. One control logic circuit suffices for several memory circuits, reducing cost. Fabrication of 3DS memory involves thinning of the memory circuit to less than 50 ?m in thickness and bonding the circuit to a circuit stack while still in wafer substrate form. Fine-grain high density inter-layer vertical bus connections are used. The 3DS memory manufacturing method enables several performance and physical size efficiencies, and is implemented with established semiconductor processing techniques.