Patents Represented by Attorney Vedder, Price, Kaufman & Kammhola, P.C.

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  • Multi-die module
    Patent number: 7215022
    Abstract: A multi-die module is electrically connected to both an unpackaged die and a packaged die as disclosed herein. The multi-die module has a footprint that is the same as conventional multi-die packages, which do not include packaged die, thereby allowing the multi-die module to be interchangeable with conventional multi-die packages. In one embodiment, the unpackaged die is a graphics processor, and the packaged die is a standard memory that has been burned in, functionally tested, and speed rated.
    Type: Grant
    Filed: June 21, 2001
    Date of Patent: May 8, 2007
    Assignee: ATI Technologies Inc.
    Inventors: Vincent Chan, Samuel Ho