Abstract: A high density interconnection device includes a high density connector block having a plurality of jacks disposed on the outer surface for common interconnected to a high density connector. A recessed portion formed on the first side surface defines a first multi-faceted surface having a plurality of angularly disposed first surface elements. A projecting portion formed on the second side surface defines a second multi-faceted surface having a plurality of angularly disposed second surface elements. In another embodiment, one group of jacks are defined in a first plane, and another group of jacks are defined in a second plane. The first and second planes are substantially parallel such that the first and second groups of jacks are offset.
Type:
Grant
Filed:
August 3, 2001
Date of Patent:
August 2, 2005
Assignee:
ATI Technologies, Inc.
Inventors:
Harjinder Dulai, Yen-Ming Chen, Colin Szeto, Edward J. Laurin, Steven D. Daniels, Jean Francois Drolet