Patents Represented by Attorney, Agent or Law Firm Victor Genco, Jr.
  • Electronic chip package
    Patent number: 6544638
    Abstract: An electronic chip package is provided having a laminated substrate. The laminated substrate includes at least one conductive layer and at least one dielectric layer which is bonded to the conductive layer. The dielectric layer has a glass transition temperature Tg greater than 200° C. and a volumetric coefficient of thermal expansion of ≦75 ppm/° C. A semiconductor device is electrically attached to the laminated substrate.
    Type: Grant
    Filed: September 10, 2001
    Date of Patent: April 8, 2003
    Assignee: Gore Enterprise Holdings, Inc.
    Inventors: Paul J. Fischer, Joseph E. Korleski