Abstract: A semiconductor device includes a lead frame assembly having a die attach pad with a die secured by a die bonding material. A portion of the die bonding material may flow out from between the die and the die attach pad to form a squash out layer. A raised bond pad is at least partially in the squash out layer area and extends upward from said die attach pad sufficient to be above the squash out layer. A bond wire has one end secured to a ground terminal on the die and the other end to the raised bond pad. The whole structure is encapsulated in a plastic package.