Abstract: A method 10, 90 for making a multi-layer electronic circuit board 82, 168 including the steps of forming at least one protuberance 15, 100 upon an electrically conductive member 12, 92 and adding additional electrically conductive layers of material 34, 56, 58, 104, 114, 138, 140 to the member 12, 92 while selectively extending the protuberance 15, 100 within the layers 82, 168, thereby forming a circuit board 82, 168. A portion of the formed circuit board may be etched in order to selectively create air-bridges 86 or interconnection portions 164.

Abstract: A system 10 for designing an automotive component such as an air induction tube 22. A CAD system 18 receives certain programmable parameters 14 and a user selected integer value 16 by way of a user interface 12, and generates a tube design 22 having a number of curved portions which is equal to the integer value 16. Each portion the resulting tube 22 is independently programmable or modifiable, thereby providing a designer with a large degree of flexibility in altering the design and/or configuration of tube 22 without having to redesign an entirely new tube.

Abstract: A method for making multi-layer electronic circuit boards 64 having “blind” type apertures 28, 30 which may be selectively and electrically grounded and further having selectively formed air bridges and/or crossover circuits 45, 46.

Abstract: A method 10, 110 for making multi-layer circuit boards having metallized apertures 38, 40, 130, 132 which may be selectively and electrically grounded and having at least one formed air-bridge 92, 178.

Abstract: A method 10 for making multi-layer electronic circuit boards having metallized apertures 34, 36 which may be selectively and electrically grounded or isolated from an electrical ground plane.

Abstract: A method for forming connections within a multi-layer electronic circuit board 10. The method includes forming an aperture within the circuit board and selectively coating the interior surface of the aperture with a polar solder mask material that is effective to bond with solder that is selectively inserted into the aperture, thereby retaining the solder within the aperture and improving the electrical connection provided by the solder.

Abstract: A multi-layer electronic circuit board design 10 having selectively formed apertures or cavities 26 which have improved solder-wetting characteristics by causing a first insulating layer to separate from a portion of a first conductive layer of the multi-layer electronic circuit board 10 which allows for communication by and between some or all of the various component containing surfaces, and portions of the formed multi-layer electrical circuit board 10, which selectively allows components contained within and/or upon these portions and surfaces to be interconnected.

Abstract: A method 10 for making multi-layer electronic circuit boards 148, 248 having aperture 146, 246 which may be selectively connected to an electrical ground potential.

Abstract: A monitor 10 is provided of the type which is deployed upon a vehicle 13 having an engine 17, an exhaust system 27 which includes a catalytic converter 12. Catalytic converter 12 is operatively and communicatively connected to inlet portion or pipe 14 and outlet portion or pipe 16. Monitor assembly 10 employs sensors 24-26 which are electrically and communicatively connected to controller 28 to operatively determine whether the catalytic converter 12 is operational.

Abstract: A vehicle driveshaft 10 having first and second splined members 12,16 which are manufactured of aluminum, which are anodized, and which respectively include relatively long and wide respective spline portions 14, 18, thereby cooperatively forming a relatively stiff driveshaft 10.

Abstract: A multi-layer electronic circuit board design 10 having a core member 12, a pair of dielectric layers 14, 16 disposed thereon, and a first circuit portion 20 which is coupled to the dielectric layer 14 and core member 12 using a layer of adhesive material 18. Circuit board design 10 further having selectively formed “blind” apertures, vias or cavities 22 formed through the first circuit portion 20, dielectric layer 14, and adhesive layer 18, thereby exposing core member 12.

Abstract: A method 10, 110 for making multi-layer circuit boards having metallized apertures 38, 40, 130, 132 which may be selectively and electrically grounded and having at least one formed air-bridge 92, 178.

Abstract: A light manifold assembly 10 having a relatively thin and low profile manifold 30 which is selectively placed within the frame 16 of a back window 14 and which receives light and/or laser energy 44 which is generated by a source 18 which is remotely located from the manifold 30.

Abstract: A moisture reduction assembly 10 for use in a vehicle headlamp 12 which operatively reduces and/or substantially eliminates moisture 22 within the headlamp 12. The moisture reduction assembly 10 includes a selectively energizable bulb 18 and a bulb shield 16. The bulb shield 16, in one non-limiting embodiment, receives and/or is lined with a heat activated catalyst 20 which is heated by the selectively energizable bulb 18 and which, when heated, chemically converts the contained moisture 22 to at least one non-condensing gas. The catalyst 20 may also be selectively applied to the bulb 18. In another non-limiting embodiment, a desiccant member 30 is disposed within and/or upon the bulb 18 or disposed within the bulb shield 16.

Abstract: A multi-layer circuit board with heat pipes and a method forming a multi-layer circuit board with heat pipes is disclosed. The circuit board includes a heat pump which communicates with the heat pipe to circulate an amount of cooling material within the heat pipe effective to efficiently dissipate heat from the circuit board.

Abstract: A light sensor assembly 10 and a method for detecting ambient light 100 which logarithmically amplifies a first signal which is representative of the certain amount of sensed light and a second offset signal and which adds the logarithmically amplified signals to a voltage signal, thereby allowing an accurate signal to be produced which indicative of the sensed amount of light by use of only a positive type electrical power supply and which is effective to allow the output signal to fall within the relatively narrow operating range of a cost effective digital to analogue converter.

Abstract: A multi-layer circuit board with heat pipes and a method for forming a multi-layer circuit board with heat pipes is disclosed. The method includes forming channels in a first and second pre-circuit assembly and attaching the first pre-circuit assembly to the second pre-circuit assembly such that the channels cooperatively form a heat pipe.

Abstract: A method 10, 110 for making multi-layer electronic circuit boards 82, 148 having metallized apertures 18, 20, 118, 120 which may be selectively and electrically connected to a source of ground potential.

Abstract: A component selector assembly 10 which pseudo-randomly energizes components 40-54 use of received data 60.

Abstract: A method for forming connections within a multi-layer electronic circuit board 10. In one non-limiting embodiment, the method includes selectively forming air bridges over portions of the circuit board 10 and selectively collapsing the air bridges with a metallurgical bonding tool, effective to interconnect layers of the circuit board 10.