Abstract: This invention provides unique resistor compositions. These compositions contain solid long chain phenolic resin, liquid short chain phenolic resin and a mixture of carbon black and graphite particles dispersed therein. The combination of these elements allows for resistor compositions that are capable of withstanding high humidity conditions without significant changes in resistivity and which are capable of low ohmic values in the absence of metals. Also provided is a method of producing these compositions.

Abstract: This invention provides conductive compositions that are solderable and flexible and that can be bonded directly to substrates. These compositions are made up of a combination of silver exclusively in the form of flake and vinyl chloride/vinyl acetate copolymer. Also provided is a method of making these compositions. Another embodiment of this invention is a method of applying conductive compositions directly to substrates by bonding the conductive compositions directly to the substrate. Once cured the compositions demonstrate good adhesion directly to the substrate in addition to good conductivity, solderability and flexibility characteristics. Additionally, these compositions are capable of being soldered by non silver-bearing solder.

Abstract: This invention provides conductive compositions that are directly solderable and that can be bonded directly to substrates. The compositions are made of silver exclusively in the form of flake and a resin system, said resin system comprising phenolic resin, acrylic resin, polyurethane resin, vinyl chloride/vinyl acetate copolymer, epoxy resin and epoxy hardner. By making a mixture of such a complex vehicle system a composition is produced that displays outstanding solderability and adhesion. Also provided is a method of making these compositions.

Abstract: This invention provides conductive compositions that are solderable and flexible and that can be bonded directly to substrates. These compositions are made up of a combination of silver exclusively in the form of flake and resin system, said resin system comprising of vinyl chloride/vinyl acetate copolymer, epoxy resin and epoxy hardner. Also provided is a method of making these compositions. Another embodiment of this invention is a method of applying conductive compositions directly to substrates by bonding the conductive compositions directly to the substrate. Once cured, the compositions demonstrate good adhesion directly to the substrate in addition to excellent conductivity, solderability and flexibility characteristics.