Abstract: A passive alignment structure for a substantially planar substrate, which is an anodic aluminum oxide structure having a vertical profile with respect to a horizontal surface of said substantially planar substrate.

Abstract: A laminated acoustic wave touch panel is shown and a method of making the panel is described using an adhesive barrier material. The adhesive barrier material is positioned between a substrate in which a shear wave is to propagate and a backplate in order to form a cavity between the substrate and backplate. An adhesive is injected into the cavity to laminate the substrate to the back plate. The use of the barrier material allows the laminated touch panel to be easily manufactured and allows the adhesive to be constrained to a desired area of the panel. The invention envisions the use of similar and dissimilar materials for the substrate and backplate. The velocity of a shear wave at a given frequency is greater in the backplate than in the substrate in the case where the materials are dissimilar and equal for a given frequency when the materials are the same.

Abstract: A package for an optoelectronic device having an optical fiber in communication therewith. The parts of the package are generally of polymer material, preferably engineering thermoplastic, which is assembled to the fiber having the device mounted on a printed circuit board type material, FR4. The adhesion process of the individual parts of the package is done typically through a solvent bonding or an epoxy curing process that is done at room temperature, thereby eliminating the drawbacks of soldering at high temperature which has the attendant disadvantage of built in stress and thermal expansion resulting in misalignment of the individual parts. The related packaging technique greatly reduces the requirements of active alignment of the fiber to the device in the packaging of the device and fiber. Accordingly, the overall cost of the device is reduced by virtue of the reduced cost of the parts of the package as well as the process for fabrication of the package.

Abstract: A passively aligned high performance optoelectronic package in pigtail form which has a reduced cost over the conventional techniques of packaging by virtue of materials and alignment techniques is disclosed. The package of the present disclosure has a ferrule made of material which substantially matches the thermal characteristics of the optical bench, with the ferrule having a flat portion on one end for securing an optical fiber on a receiving group of the optical bench. The material of the ferrule is preferably kovar. Finally, passive alignment of the optoelectronic device to the fiber is effected by way of the ferrule with the flat portion of the ferrule being partially disposed in a second ferrule or sleeve prior to commitment of the sub-assembly into the final package.

Abstract: An integrated impedance matching circuit is disclosed using a flip chip process and a heterlithic microwave integrated circuit (HMIC). In a preferred embodiment, a silicon microwave power transistor is flip chip mounted on a glass substrate having a ground plane and silicon pedestals 404 selectively etched and having glass disposed about the silicon pedestals to form the substrate. The glass substrate of the present invention is finely ground and polished to enable VLSI techniques for mass production fabrication. To this end, photolithography and deposition techniques well-known in the art are utilized to effect impedance matching circuitry. Because the input impedance of the Si power transistor is relatively low, by using the flip chip technique the precision of the impedance matching circuit can be effected without the use of wire bonds which must be tuned in a labor intensive manner.

Abstract: An optical subassembly for monitoring the emission of a semi-conductor laser is disclosed. The subassembly is diced from a wafer having mounted thereon the devices to be tested as well as the testing optical devices. The devices of the wafer are burned-in and those sections of the wafer having lasers that pass the burn-in testing are diced and form the subassemblies of the present invention.

Abstract: A package for an optoelectronic device comprising: a substrate, an optical fiber disposed on the substrate, a ferrule for receiving the optical fiber and having a substantially flat surface for mounting the substrate; a housing member having a first end and a second end. The ferrule is disposed in the first end and a plug member is disposed in the second end of the housing.

Abstract: The present invention discloses a substantially co-linear header 100 for the alignment and packaging of an optoelectronic device 503 on an optical header with an optical fiber mounted in an optical fiber sleeve 101. The substantially co-linear arrangement of the optical sleeve with the integrally molded lens member 102 and the optoelectronic device 503, enables good performance characteristics through the elimination of reflective and refractive surfaces as disclosed in the prior art. Furthermore, the overall cost of assembly as well as of the materials required to effect the package of the present disclosure is substantially reduced over conventional design. The final result is a packaged optoelectronic device which is passively aligned to an optical fiber to effect optical communication therebetween a substantially reduced cost and improved performance characteristics.

Abstract: Light emitting devices are requiring greater switching speeds to achieve greater modulation bandwidths. The problems of intrinsic capacitance associated with conventional semiconductor heterojunction devices are reduced by the reduction of pn junction capacitance as well as the use of a semi-insulating blocking layer and a conductive substrate. Furthermore, a light absorbing layer is disposed on one side of an unetched portion of the semi-insulating material and an active layer disposed on opposite side. Also, the interface of the semi-insulating material and the active and absorbing layers are at prescribed angles that reduce back reflections to the absorbing and active layers. This arrangement reduces pumping in the absorbing region and thus reduces the lasing effect, allowing for a stable LED. The angle at the interface is determined by having the structure at a predetermined crystallographic direction and having the semi-insulating mesa etched to reveal a predetermined crystalline plane.

Abstract: A bidirectional link for simultaneous or sequential transmission and reception of optical signals is disclosed. A simple alignment process is used in which the emitter or transmitter is disposed in a subassembly having a subhousing with a beamsplitter therein. This is then inserted into the main housing with the other device mounted therein.

Abstract: A planar hybrid optical amplifier is fabricated on a single crystal substrate. The components that are common to a variety of optical amplifier circuits are mounted on the substrate and the planar device that results is readily interchanged in various applications. In one embodiment the multiplexed signal consisting of light from a pump laser and an optical signal are introduced into a rare earth doped fiber which amplifies the input signal through stimulated emission of radiation.