Abstract: Articles (18) are transferred from a first position, such as a feed track (37) on which they are located closely spaced, to a second position such as a heat seal apparatus. At the heat seal apparatus the spacing of the articles is to coincide with the spacing of frame members (32) to which the articles are to be joined. The change in the spacing occurs during the transfer of the articles from the first to the second positions by means of a transfer mechanism (41). A plurality of pickup members (43) are slideably mounted to an arm (44) of the mechanism (41). The pickup members (42) which are resiliently urged apart with respect to each other are forced together at one end of the travel of the arm (44) to assume the close spacing established by the width of the pickup members. At the other end of the travel of the arm (44) the resilient urging force drives the pickup members (43) against predetermined stop positions.

Abstract: Workpieces (11), such as semiconductor wafers, are treated in a plasma reaction apparatus (10). The wafers are loaded onto a workholder (18), where they become seated in contact with facing surfaces of a plurality of spaced, parallel plates (19, 21). Plasma is generated in each of the spaces (23) between two adjacent ones of the plates by coupling such adjacent plates to opposite terminals (31, 32) of an R-F generator (29). Each of the plates is comprised of a base structure (41) of a thermally stable, conductive material, such as graphite. The base structure is covered with a first layer (43) of a hard material, such as silicon carbide to impart wear resistance to the graphite. The layer (43), in turn, is covered by an outer, conductive layer (44) which, in the described embodiment is a layer of aluminum.

Abstract: In the manufacture of electrical coils (10), particularly large transformer coils, an insulated wire (11) is wound on a rotatable winding arbor (12) so as to form a succession of turns of the insulated wire. Particularly when large gauge enamelled copper wire is wound, the insulation (14) has a tendency to crack or chip during the winding process, causing shorted turns and producing a defective coil. This application relates to systems for testing such a coil to detect a short as it is wound so as to permit interruption of the winding process and repair of the insulation fault on the spot. The test equipment includes a pair of test windings (41, 42) positioned at opposite ends of the winding arbor (12) and magnetically coupled by flux paths (50, 51) to each other and to the coil being wound so that an A.C. input signal (V.sub.1) applied to the first winding (41) induces an A.C. output signal (V.sub.

Abstract: Paramagnetic articles such as a stem (14) and an armature (17) are placed into mutual coextensive alignment with a gap (19) of a predetermined width between adjacent portions of such articles. To repetitively establish the predetermined gap between successive groups of such articles, a first of such articles is guided tangentially into a magnetic field. A resulting force on such article (14) draws the article against a first stop surface. The article becomes magnetically polarized, such that when the second article, such as the armature (17) is guided into coextensive alignment with the first article, the second article becomes attracted to the first article to be drawn against a stop surface opposite to and spaced from the first stop surface by a dimension equal to the predetermined gap width.

Abstract: A technique for identifying and measuring a first surface area and apparatus for aiding such identification are disclosed. Each incremental portion of said first surface area and at least adjacent portions of surrounding surface areas are illuminated with diffuse light incident through a predetermined sectorial angle related to an anticipated waviness of the surface areas. The first surface area so illuminated is then measured by opto-electronic measuring techniques whereby measuring errors caused by shadow effects due to waviness in the surfaces are minimized by substantially uniform light dispersion within the sectorial angle.

Abstract: An electronic device (10) is attached to a carrier tape (20) by a cluster (22) of leads (12) which are closely spaced relative to each other. The device (10) is detached from tape (20) along with the leads (12) and tape members (28) interconnecting such leads (12) for maintaining the spacings therebetween. The leads (12) are formed with a given configuration while the members (28) are still attached. Such members (28) are then trimmed from the leads (12) to electrically isolate such leads (12) while still maintaining the desired spacings therebetween.

Abstract: Articles (12) are loaded onto a movable article holder such as pedestals (18) mounted to a rotary table (20). The table is indexed to advance the articles (12) first to a centering station (41) and then to a work station (49) which may be, for example, a lead frame bonder. At the centering station (41) a typical centering mechanism (22) urges the articles to a predetermined center location. While the centering mechanism may be adjusted to and fixedly located in a position to center the articles (12) to a theoretical center removed by precisely one step or a multiple thereof from the bonding position, the centering station (41) provides for tangentially shifting the theoretical center with respect to the table (20). Any shift of said theoretical center is made to offset an anticipated error of alignment of the articles, even though such error may be unique to each of the pedestal positions.

Abstract: The walls 41 (FIG. 4) of thru holes 11 in a printed wiring board substrate 12 are coated with a liquid 24 by inserting fingers 22 into the thru holes. Each of the fingers has a diameter slightly less than the diameter of the associated thru hole and has a length no greater than the thickness of the substrate 12. After ink 24 has been applied to the top surface of the substrate, the inserted fingers 22 are withdrawn, thereby drawing the ink down into the thru holes and coating the walls 41. In another embodiment, fingers 62 are aligned with selected portions 52 of an edge 55 of the substrate 50 to coat the portions of the edge as the fingers are moved by the edge after the heads of the fingers have been coated with the ink 24.

Abstract: Paramagnetic articles such as a stem (14) and an armature (17) are placed into mutual coextensive alignment with a gap (19) of a predetermined width between adjacent portions of such articles. To repetitively establish the predetermined gap between successive groups of such articles, a first of such articles is guided tangentially into a magnetic field. A resulting force on such article (14) draws the article against a first stop surface. The article becomes magnetically polarized, such that when the second article, such as the armature (17) is guided into coextensive alignment with the first article, the second article becomes attracted to the first article to be drawn against a stop surface opposite to and spaced from the first stop surface by a dimension equal to the predetermined gap width.

Abstract: A breakaway registration pin (11, FIG. 2) comprises two sections, a first section (21) embedded in a glass art master (10) and a second section (22) bonded by a bonding agent to a top face (33) of the embedded first section (21). The bonding agent has a strength substantially less than the strength of the glass such that the registration pin (11) will break before the glass in art master (10) cracks when a force is applied to second section (22).

Abstract: A circuit pattern printing system includes alignment apparatus (71) which is located remote from a printer (35). The alignment apparatus includes a means for displaying a cursor (69) on a video screen (101). The cursor identifies a desired position of a fiducial mark (61) printed on a substrate (106) when the substrate is positioned against a reference guide (86) on an alignment table (76). The cursor (69) and the reference guide (86) are aligned to each other by first aligning the reference guide (86) to an alignment marker on a standards substrate (41), and then aligning the cursor to a fiducial mark located on the same standards substrate.

Abstract: A pair of opposite surfaces (17 and 18) of shaped, digitated edge features (12) of a metal strip (11) are selectively treated in an electrolytic treating cell (32) while adjacent edge surfaces (22 and 23) of such features are shielded from exposure to the treatment. The desired treatment, such as a gold plating process, is accomplished on two opposite, outwardly facing surfaces of a strip of center carried pins by engaging the strip with lateral masking belts having complementary edge features. The strip and the masking belts are passed through a treating cell between paired off electrodes (40 and 41). An electric field between each electrode and the respective, adjacent surface of the strip (11) accomplishes the treatment. Slotted openings through the masking belts relieve pressure differentials in the electrolyte on either side of the strip to minimize fluid flow through gaps between the digitated strip and the masking belts.

Abstract: An n-type region of a semiconductor body, such as a surface region of a bulk wafer or an epitaxial layer region grown on a wafer (12), is successfully submitted to a capacitance-voltage test using a mercury probe (11) after being subjected to a pretreatment. The pretreatment includes forming a thin oxide layer, preferably in the order of 10 to 20 Angstrom units thick, on the surface of the wafer (12), and pulsing the mercury into contact with the pretreated surface while a reverse bias voltage is applied between the mercury and the region. If a resulting reverse leakage current exceeds a desired current threshold value, the pulsing of the mercury into contact with the surface of the water (12) is repeated until a rectifying contact having a sufficiently low reverse leakage current through the mercury-to-semiconductor interface has been established.

Abstract: A Czochralski-type crystal growing apparatus (10) supports a crystal (12) with respect to a melt (14) by a plurality of flexible cables (41, 42 and 43). The supporting lengths of the cables are radially offset in a horizontal plane from a vertical central axis (29) about which the growing crystal (12) is rotated with respect to the melt (14). Because of their radially offset position, the cables have the capacity to oppose a torque which is typically generated by the relative rotation of the crystal with respect to the melt. The supporting cables (41, 42 and 43) also impart increased orientational stability to a lower support bracket (26) which holds the crystal (12) relative to the melt (14).

Abstract: A surface of a substrate 11 (FIG. 2) is uniformly coated with a liquid L by wetting the surface with the liquid and compressibly contacting the wetted surface with an applicator member 10 having an outer layer 14 of a compressible liquid absorbing material with inverse sponge characteristics and an inner layer 13 of compliant material. Preferably the member is a roller 10 having a silicone rubber or polyurethane inner layer and a chamois outer layer. A plurality of the rollers 10 are arranged to be in compressive contact with the surfaces of a plurality of substrates 11 as the substrates are being removed from the liquid L (arrow A), the movement of the substrates 11 causing rotation (arrow F) of the rollers to apply a uniform coating of the liquid on the contacted surfaces.

Abstract: A diffusion furnace (11) includes a typical process tube (12) and an outer envelope (26) which forms an annular chamber (37) with the process tube. A heating element (29) of high purity graphite substantially surrounds the process tube within the chamber (37). Inner surfaces of the chamber (37) are made of materials such as, for example, silicon, pyrolytic graphite or quartz. Such materials are essentially free of harmful impurity elements such as iron, nickel, copper calcium or gold, which have an energy level about halfway between the valence and the conduction band of a semiconductor material to be processed within the process tube. A nonoxidizing gas within the heater chamber protects the graphite elements therein from oxidation. A small gas flow within the chamber (37) is preferred to purge such harmful impurity elements as may penetrate into the chamber during the operation of the furnace.

Abstract: An electronic device assembly (11) includes a heat dissipating substrate (18) having a seat (16). A device (14) is uniformly spaced from a base surface of the seat (16), and a layer of solder of uniform thickness occupies a gap between the surface of the seat and the device. Leads (31) and (33) extend at a shallow, acute angle from the device. A lead (32) is mounted to a support (28) extending from the substrate (18). Inner portions of the leads (31, 32, 33), the device (14) and portions of the substrate (18), are encased by an envelope (22), while outer portions (67) of the leads and a mounting tab (19) of the substrate extend from the envelope.

Abstract: Initially randomly oriented elongated articles (11) are uniformly oriented and inserted into cavities (47) of a magazine (48) in a mass insertion process. The articles (11) are first aligned in parallel grooves (32) of a rack (31), wherein they initially retain a random longitudinal orientation. The articles (11) are then translated longitudinally in one or the other direction depending on their orientation in the rack. Those of the articles extending in the one longitudinal direction are first transferred to the magazine (48) while the other articles remain in the rack. The longitudinal orientation of the remaining articles is thereafter reversed by rotating the rack about its longitudinal axis, and the remaining articles are inserted into the magazine as the complement of such first transferred articles.

Abstract: A Hybrid Integrated Circuit package (11) typically includes a circuit substrate or article (12) on which are formed thin film components (17, 18, 19) of a circuit (22) and to which is bonded at least one semiconductor chip (21). Prior to bonding the chip (21) to the article (12) the circuit (22) undergoes various tests and adjustment operations. An electric element, preferably a resistance element (36), is formed on the article (12). The element (36) is functionally independent of the circuit (22) on the article (12). A first, initial value of the element (36) marks the article (12) as belonging to a first group of articles having first circuit characteristics. The initial value of the element (36) is selectively altered to a second value upon a determination that the article (12) has circuit characteristics other than those of the first group. In the described preferred embodiment the first group is a group of electrically acceptable articles (12), while other characteristics are those of defective articles.

Abstract: A holder (55) for supporting in alignment a plurality of spaced electrodes (18) and (19) to be sealed into a corresponding plurality of envelopes (14) includes a metal base (82) which supports a stripper plate (87). A plurality of posts (36) extend from the base (82) through a plurality of seats (86) in the stripper plate. In preparation for a mass sealing operation the envelopes (14) are placed onto the seats (86) and a pair of the electrodes (18) and (19) are attached to the end of each of the posts (36). A graphite heater plate (61) having a plurality of apertures (72) is joined with the base plate (82) such that the apertures rest in concentric alignment about upper ends of the envelopes (14). An upper weight plate (92) rests on the heater plate (61) to bring weighted guide caps (46) into contact with the electrodes (18) and (19).