Abstract: Apparatus for programmably orienting a semiconductor wafer in an ion implantation system so as to limit channeling and to control the depth of penetration of impinging ions. The apparatus is associated with a processing chamber door and includes a rotatable vacuum chuck for engaging the wafer and a motor for rotating the vacuum chuck and the wafer through a preselected angular displacement. The apparatus further includes a programmable control assembly operative to deenergize the motor upon sensing rotation of the vacuum chuck through the preselected angular displacement. The wafer orientation apparatus is typically utilized in a system for the vertical transfer of wafers between a cassette and a processing chamber.

Abstract: A direct contact hyperthermia applicator includes an ultrasonic lens with an array of ultrasonic transducers and an array of microwave antenna elements mounted behind the lens and positioned for transmission of ultrasonic wave energy and microwave energy therethrough. The antenna elements can be waveguide sections having radiating apertures or microstrip antenna elements. A fluid enclosure is defined between the front surface of the lens and a thin rubber sheet sealed around the periphery of the lens. During hyperthermia treatment, the rubber sheet conforms to the contours of the patient's body. The fluid, which is typically cooled distilled water, improves coupling of microwave energy and ultrasonic wave energy into the patient's body and cools the surface region.