Abstract: In a local area network system having redundant communication media and a plurality of nodes, each node is connected to the redundant communication media. Each node is capable of communicating with each other node in accordance with a predetermined protocol via the redundant communication media. Further, each node is capable of disconnecting from the redundant communication media when an error in communications is detected. A method of automatically reconnecting the node to the redundant communication media after the node disconnects from the redundant communication media comprises the following steps. When a faulty condition is detected, the node disconnects itself from the redundant communication media. Internal testing of the node is then performed. If the internal testing passes, the node attempts to reconnect itself to the redundant communication media.

Abstract: A semiconductor device having a metal interconnect feature which comprises an array of metal features. Each of the metal features in the array has a size not substantially larger than a predetermined feature size. The metal features in the array are connected together by a metal layer deposited over the array of metal features.

Abstract: A magnetic, solid state memory cell or sensor includes a magnetoresistive, ferromagnetic layer and a resistive layer overlying the magnetoresistive layer. The resistivity and dimensions of the resistive layer are such that, preferably, only a small fraction of any sense current flowing through the cell or sensor will flow between input and output contacts by way of the resistive layer, yet the magnitude of the sense current will not be reduced below a desired signal level due to the presence of the resistive layer. The resistive layer is comprised of a material which will not diffuse into the magnetoresistive layer. A compound or mixture of a metal and either nitrogen or oxygen, such as tantalum and nitrogen, is perferred as the resistive layer. It is also preferred that the resistive layer be nonmagnetic.

Abstract: A wet-to-wet pressure sensor package (10) having a housing (12) with a pressure sensitive semiconductor die (34) supported within a resilient mounting (44) including continuous beads (46, 48) of elastomeric adhesive on the same portion of the housing to provide a protective seal with less stress so that improved sensitivity and repeatability of the wet-to-wet pressure sensor is achieved.

Abstract: A data storage latch which permits forming a feedback loop for storage and permits storing data signals in an open loop configuration using logic circuit elements based on cross-coupled transistor loads.

Abstract: A flexible film has electrical interconnections on each side. Through-film interconnects pass through openings in the film to connect the electrical interconnects on opposite sides of the film. Electrical contact patterns are formed on one side of the film to accomodate integrated circuit chips or other small electronic devices. Multi-chip circuits can be formed by connecting the chips to the pattern areas and connecting the patterns by way of the electrical interconnections on either side, or on both sides.

Abstract: An assembly for relieving shear stress when indirectly mounting a glass tube to a metallic header containing a pressure to be measured. A bore within the header includes first and second shoulders and first and second radially outwardly extending surfaces. An iron-nickel interface having an axially extending position and a radially outwardly extending portion is secured to the header by welding only at the juncture of the inside radius of the axially extending portion with the first shoulder, leaving the interface free to expand nearly stress free along the radially outwardly extending surfaces within the bore.

Abstract: A distributed geophone data acquisition system is disclosed that includes a receiver for the geophone data and a plurality of data cables connected together and to the receiver at one end. The cables have a plurality of twisted pairs of electrical conductor channels and two fiber optic light guides. Multiple geophone takeouts are connected to separate channels of the cables. Remote data units are connected between adjacent ends of each data cable that convert the geophone signals on each channel to light signals for transmitting through the fiber optic light guide of the next cable to the next remote data unit and ultimately to the receiver.

Abstract: A bipolar transistor with a laterally elongated emitter and base so a laser can diffuse dopant from that emitter through that base to the corresponding collector.

Abstract: A sleeveless glass to metal solder joint wherein the glass is coated with a solder wetable metal. The invention is particularly useful in high pressure environments or as part of a pressure sensor assembly which includes a silicon based pressure sensor.

Abstract: A component metallization interconnection system in a monolithic integrated circuit system for providing electrical interconnections between circuit components and for providing magnetic interaction regions for information storage.

Abstract: Disclosed is a method of manufacturing a high-yield solder bumped semiconductor wafer. The method comprises providing a non-solderable transfer substrate having a transfer surface for receipt of solder material; depositing solder material onto the transfer surface to form solder bumps in a predetermined pattern; aligning solderable conductive elements of a semiconductor wafer with the predetermined solder bumps on the transfer surface; and reflowing the patterned solder bumps into wetted contact with the wafer conductive elements.

Abstract: Disclosed is a direction sensing apparatus employed with universal connectors at the data units located along a data transmission cable. Each connector includes an optical source and an optical detector and the connecting segments cable between units each includes two fiberoptic conduits. One is for the transmission of control signals in a direction away from a master station and the other is for the transmission of the data signals toward the master station. Logic circuitry within each unit determines the presence of the first light source detected at the unit and switches the signals modulated thereon to the command channel within the unit. This switching also applies the signals modulated on the second-in-time light source detected at the unit to be applied to the data channel within the unit. Hence, it makes no difference which of the two connections at each data unit is used for connecting with the preceding station or with the succeeding station.

Abstract: A magnetic solid state device, such as a magnetoresistive memory cell, includes first and second layers of magnetoresistive material. The first and second layers are separated by a third layer which prevents exchange coupling between the magnetic dipoles of the first and second layers. The first, second and third layers are formed as a strip. A fourth layer of a resistive material, such as nitrogen doped tantalum, overlies the first layer. The fourth layer includes spaced, raised portions over which electrically conductive material, such as TiW, may be formed on top of the raised portions.

Abstract: A re-configurable register bit-slice is disclosed for use in built-in logic block observers (i.e. BILBOs). The register bit-slice may be configured to a plurality of operational modes. Front-end logic is disclosed which switches a single current switch (e.g. transistor) between a data input and an output of the front-end logic. Thus, a single current switch of delay is added to normal operation of a standard shift register modified to be reconfigurable.

Abstract: A sensor comprising a die having a sensing portion. The sensor further comprises apparatus for enhancing the sensitivity of the sensing portion, the apparatus for enhancing comprising a mass rigidly attached to a portion of the die. The sensor also comprises two mechanical stops. One stop includes a portion of the die, and the other stop is rigidly spaced away from the die. Movement of the mass is limited by the two stops.

Abstract: Disclosed is a system and method for controlled compression furnace bonding of a semiconductor chip to conductive elements of a leadframe. The system comprises a holding member having a chip support surface for supporting a semiconductor chip and a positioning system for precisely positioning conductive elements of a leadframe with corresponding bonding locations on the semiconductor chip. A furnace heating system comprising a furnace is employed for heating and bonding the conductive elements to the chip bonding locations.

Abstract: The improvement of the present invention provides configurable selection circuitry, which may be used to substitute auxiliary memory locations into a matrix memory. The configurable selection circuitry, after configuration, operates in response to selected signals to drive an auxiliary memory location while disabling the memory location formerly driven by the selected signals.

Abstract: A monolithic integrated circuit memory control operating through the use of MOS field-effect transistors with diode or bipolar circuit arrangement for the bit line column switching.

Abstract: A camera, means for varying the direction of the field of view of the camera and means for focusing the camera are all secured within a water-tight enclosure. The enclosure has a transparent viewing port and is spherical or near spherical. No moving parts extend beyond the enclosure and a single cable housing contains all wires and control lines leading to the enclosure.