Abstract: A solderable gold conductor composition is formed by dispersing gold and certain inorganic binders in an inert liquid vehicle composition which can be used to produce conductor patterns which patterns adhere to fired ceramic substrates and to which can be soldered leads of electronic components. Limited ranges in the composition of, and the amount of, the binder particularly the amount of copper oxide are effective to produce adhesion of the composition to fired substrates and in permitting copper leads of electronic devices to be soldered to pads of the gold composition using a lead-indium solder after the composition has been fired on a substrate. Strong solder joints are produced without the necessity for physically or chemically cleaning the pads prior to soldering. The binders comprise certain amounts of the crystalline materials, copper in the form of copper oxides CuO or Cu.sub.2 O, cadmium in the form of CdO, lead in the form of PbF.sub.

Abstract: In a computer system, with a system interface unit (SIU) for controlling data transfers between a lower speed main memory and either a central processor unit (CPU) or a high-speed cache memory unit (CMU), a cache memory command buffer (CMCB) circuit allows the SIU and CMU to operate independently of each other and ensures that commands to the CMU and SIU are executed in proper sequence. The CMCB circuit includes a stack sequence control scheme with circuitry for storing read and write signals from the CPU into read and write buffers and for outputting these signals to the CMU and SIU without interrupting the operation of either unit. The sequence control circuit includes an address decision network, a stack memory containing buffer pointers which indicate where the CPU read/write signals are located in the buffers, and a plurality of pointer registers or binary counters which indicate where buffer pointers (for particular read/write operations by the CMU or SIU) are located in the stack memory.

Abstract: An apparatus for receiving optically encoded binary data transmitted over an optical fiber from an optical transmitter device coupled to another data processing system. The receiver apparatus is used to convert the light signal carrying the subject data into TTL level digital logic signals. The receiver apparatus is comprised of circuitry for converting the optically encoded data into electrical signals in serial format, and circuitry for converting these electrical signals into TTL level digital signals in parallel format for use by a user device. The primary advantage of the apparatus disclosed here is the ability to substitute a single optical fiber for a plurality of parallel copper wires for carrying data between one data processing device and another with little or no loss in speed due to the larger bandwidth of optical fibers.

Abstract: Material handling apparatus in which a rectangular laminar fixture for a segment of film is provided with asymmetrically positioned recesses. The fixtures are adapted to be loaded into, stored in, and removed from a magazine provided with projections around which the recesses of the fixture stored in the magazine slidably fit. Only fixtures having the correct orientation with respect to the magazine can be stored within the magazine. The recesses of the fixtures and the projections of the magazine prevent a fixture stored in the magazine from changing its orientation.

Abstract: An information communication system having several transceivers connected to a communication medium. Each transceiver connected to a collision avoidance apparatus which determines if another transceiver is preparing to transmit on the communication medium by applying a unique predetermined D.C. voltage level to the communication medium.

Abstract: There is disclosed herein an apparatus for encoding, storing, updating and decoding data indicating the order of usage of memory locations as in a cache memory. An array of memory bits is encoded by a field programmable logic array each time a memory device or other peripheral is accessed by a method which need change only a portion of all the memory bits in a row. Each row corresponds to a group of memory locations or peripherals to be monitored. When the order of usage of a group of monitored locations is to be determined a field programmable logic array decodes the corresponding row and outputs a signal indicating the least recently used one of the memory locations of interest.

Abstract: Exposed surfaces of a layer of a copper thick film paste on a multilayer substrate are cleaned after being fired so that such surfaces are readily solderable to the extent that conventional tin/lead solders will wet said surfaces. The substrate with the exposed surfaces of a layer of a fired copper thick film paste is cleaned by being immersed in a warm dilute solution of an acid containing a fluoride ion, such as HF or HBF.sub.4 for a short period of time. After the short period of time of immersion has elapsed, the substrate is removed from the dilute acid solution and rinsed to remove substantially all traces of the cleaning solution.

Abstract: There is disclosed herein an apparatus for use in automated testing of elements in data processing systems such as the central processing unit. The system is comprised of a microprocessor with associated firmware, RAM and peripheral communications devices. There are two communication interface ports for receiving commands and instructions from local and remote computer terminals or from data processing units programmed to cause the testing apparatus to perform predetermined sequences of tests. There is also a port for connection to a portable maintenance panel which can be held in the hand of a field engineer for controlling the testing apparatus. The system is designed to replace prior art maintenance panels used for debugging computer hardware.

Abstract: A solderable conductor pattern is formed on a ceramic substrate. The material of the conductor pattern is made by dispersing gold and certain inorganic binders in an inert liquid vehicle composition. Limited variations in the ranges of the amounts of the material in the composition particularly the range in the amount of copper oxide in the binder produce good adhesion of the pattern to fired substrates and simultaneously provide strong solder joints between leads of electronic devices soldered with a lead-indium solder to pads of a pattern of such material after the pattern has been fired on a substrate without the necessity for physically or chemically cleaning the pads. The binders of the material comprise certain amounts of the crystalline materials, copper in the form of its oxides CuO or Cu.sub.2 O, cadmium in the form of CdO, lead in the form of PbF.sub.2, and the balance being a glass which also contains lead and some cadmium.

Abstract: A one's complement adder for adding two binary numbers A.sub.i, B.sub.i in the one's complement system is constructed from a conventional adder circuit by connecting the generate output signal G produced by the adder to the carry-in terminal of the adder. The value of the generate signal is independent of the signal applied to the carry-in terminal which prevents the adder from exhibiting sequential or indeterminate behavior.

Abstract: A solderable gold conductor composition is formed by dispersing gold and certain inorganic binders in an inert liquid vehicle composition which can be used to produce conductor patterns which patterns adhere to fired ceramic substrates and to which can be soldered leads of electronic components.A method of soldering a copper lead to a lead pad on a substrate. A conductor pattern including at least one lead pad is printed on the substrate using a gold thick film paste composition. The gold composition is composed of finely divided gold particles and finely divided inorganic binder particles dispersed in an inert liquid vehicle, containing by weight 98-99 percent gold particles and complementally 2-1 percent of inorganic binder particles. The binder consists essentially by total weight of gold and binder of 0.6-0.2 percent copper, 0.2 percent lead, 0.2 percent cadmium and the balance being glass.

Abstract: In a data processing system, groups of characters to be manipulated in a predetermined manner are transferred between storage units and a central processing unit by apparatus and a method which identifies and corrects a character of a group with sign information superimposed on an identified character position for data entering the central processing unit. After identification of the character position containing the sign information superimposed on a character position, the value of the character in the identified character position is determined by apparatus removing the superimposed sign information and such value is placed in such identified character position in the entering character group. A data string including an identified character position can then be entered in the execution unit of the central processing unit for execution of instructions.

Abstract: There is disclosed herein an apparatus for automatic monitoring of numerous high speed drill spindles on a numerically controlled drilling machine for purposes of immediate detection of the absence of drilling by a particular spindle because of a broken drill bit. The apparatus detects the absence of drilling, interrupts the automatic cycle of the drilling machine and alerts the operator. Power dissipation in each drill spindle motor is compared just prior to entry of the drill bit into the workpiece and after entry if any. If power dissipation increases above a predetermined threshhold level for all spindles, no interrupt is generated. If power dissipation does not increase in one or more spindle motors, comparator circuits alert a digital processor which interrupts automatic operation of the drilling machine and alerts the operator. Such a system eliminates the expense and error of human visual monitoring and generation of expensive scrap improperly processed before discovery of the broken bit.

Abstract: In a data processing system wherein memory space in a memory unit is divided into addressable locations capable of storing a group of signals of predetermined number called signal words, and wherein an entire word or groups of entire words are exchanged between the memory unit and a central processing unit, more efficient operation of the data processing unit can be obtained if groups of related signals called operands can be stored consecutively in the addressable locations without regard to the word boundaries. Thus, operand boundaries can have arbitrary positions in boundary words. When a word containing an operand boundary is transferred to the central processing unit, non-operand data is also transferred with the word. The non-operand data occurring in the boundary words is removed from the operand signal group and stored in the central processing unit.

Abstract: This relates to a method and apparatus for testing printed circuit boards. The printed circuit board to be tested is placed on a metal plate and covered with a thin plastic film. The plastic film is coupled to the metal plate to form a substantially air-tight chamber occupied by the printed circuit board. A vacuum is then created in the chamber to secure the printed circuit board. A capacitance meter has a first terminal coupled to the metal plate and a second terminal coupled to a probe which is used to puncture the plastic film to make contact with electrical interconnects on the board.

Abstract: In a stack for use in a data processing system memory controller, information which includes data, instructions and/or commands generated by a requesting unit requesting access to memory are accepted and temporarily stored in the stack if such memory is unavailable. The newest information from any requesting unit that must be temporarily stored is stored in the lowest unoccupied level of the stack. Associated with each stack level is a busy flip-flop which is set when the information is stored in its associated stack level. The busy flip-flop is reset when the information is given access to the memory. The level busy flip-flops are monitored to detect when the stack is full thus indicating that further requests be inhibited. By monitoring the number of levels in the stack that are filled at various times, a measure of throughput can be achieved in order to determine whether the stack should be enlarged or made smaller.

Abstract: An automation system for cutting segments from a strip of film wound on a reel, mounting the segments in reusable fixtures and stacking the fixtures in a magazine.

Abstract: This relates to an apparatus and method for providing an accurate data group to the instruction buffer of a data processing system.The data group is simultaneously applied to the instruction buffer and to the error correcting apparatus. After analysis of the data group in the error correcting apparatus, the operation in progress is aborted if an error has been detected, and the error is not correctable. If correctable, the correct instruction data group is applied to the execution unit. If no error is detected in the data group, utilization of the data group proceeds uninterrupted.Two, three state busses are employed. The first three state bus is used to transmit memory data to the error detection and correction (EDAC) circuitry, to transmit corrected data from the (EDAC) circuitry and to the data output circuits and to transmit input data to the memory.

Abstract: This relates to a digital data recovery system for decoding group coded data bits stored on magnetic tape whereon a "1" is represented by a flux reversal and an "0" is represented by the absence of a flux reversal with no more than two successive zeros throughout the data record. Input logic detects transitions of input data and forwards this information to an envelope detector which determines if subsequent transitions represent valid data. The presence of valid data enables a data rate detector which determines the average data rate. An output sequencer determines when a decoded output data bit should be generated and its proper polarity.

Abstract: An improved air distribution system for cooling electronic components mounted on printed circuit boards. The system includes an air plenum chamber of rectangular cross section. Openings are formed in the side walls of the chamber to permit air under pressure from within the chamber to flow outwardly in a direction substantially normal to the outer surfaces of the side walls and over the components to be cooled. A baffle in the form of a thin sheet of metal is mounted in the plenum substantially parallel to the side walls to divide the interior into two substantially equal portions. A large number of small round holes are formed through the baffle the area of the holes occupying substantially 36 percent of the total area of the baffle. An air pump supplies air under pressure to the interior of the plenum chamber.