Patents Represented by Attorney W. Wayne Liaum
  • Patent number: 5645977
    Abstract: A method for making molds for use in manufacturing multiple-lead microstructures is disclosed. Each of the molds comprises a set of punch head molds and a set of matching die plate molds, and the method comprises the steps of (a) dividing the multiple-lead microstructure into a plurality of portions, each portion is to be prepared by a pair of a punch head, which contains a plurality of prutrusions, and a die plate, which contains a plurality of matching recesses; (b) preparing each of the punch head molds using a first lithographic technique; and (c) preparing each of the die plate molds using a second lithographic technique.
    Type: Grant
    Filed: September 22, 1995
    Date of Patent: July 8, 1997
    Assignee: Industrial Technology Research Institute
    Inventors: Tung-Chuan Wu, Jar-Sian Hsiau, Min-Chieh Chou, Jiing-Song Lu, Mu-Tien Liang