Abstract: The present invention provides a method for manufacturing a semiconductor device. In one embodiment, the method for manufacturing the semiconductor device includes a method for manufacturing a zener diode, including among others, forming a doped well within a substrate and forming a suppression implant within the substrate. The method for manufacturing the zener diode may further include forming a cathode and an anode within the substrate, wherein the suppression implant is located proximate the doped well and configured to reduce threading dislocations.

Abstract: A clock multiplier (40) comprises a digital phase lock loop circuit having a single variable delay stage (44) for generating high and low phases for the output clocks. The variable delay stage (44) includes a commutator 64 which chooses between the signal propagating on first and second delay paths (52 and 54). The delay on the delay paths can be incrementally adjusted using capacitors (58 and 61) selectively enabled between the path and ground. If the variable delay is insufficient to lock the output to the reference clock, a prescaler (72) automatically divides the output as needed. A stutter mode prevents short pulses, caused by a transition of the reference clock arriving shortly after the transition of the output clock to a low state, from being passed to the clock multiplying circuitry. The clock multiplier (40) may use a free running mode after lock is obtained, where adjustments are made relative to the degree of difference between the output clock and the reference clock.

Abstract: A circuit is designed with a first reference circuit (202) for producing a first reference voltage in response to a first voltage. A second reference circuit (204) produces a second reference voltage in response to the first voltage and a second voltage. A sampling circuit (210) stores the first reference voltage and the second reference voltage and produces a first sample voltage and a second sample voltage. A comparator circuit (222) is coupled to receive the first sample voltage and the second sample voltage. The comparator circuit produces a control signal in response to a difference between the first sample voltage and the second sample voltage. A generator circuit includes an oscillator circuit (226) and a pump circuit (230). The generator circuit produces a first supply voltage in response to the control signal.

Abstract: A removable tab process whereby tabs (7) are affixed to the pads (3) by initially having the bonding surface as flat as possible so that bonding pressures from pad to pad are relatively uniform. Bonding is performed with the pressure applied to the pads being such that the tabs can later be easily removed without damage to the die pads, yet sufficiently strong so that the tabs do not come loose during burn in and testing. A bond strength pull between about 5 and about 40 grams per pad is appropriate for this purpose. The tabs are removed by placing the tested die (1) and attached tabs in a fixture (11) and providing a tool (31) dimensioned and moved along a path (13, 15, 17, 19) whereby each of the tabs is serially removed with the pressure applied to each tab to provide removal being preferably no greater than 40 grams.

Abstract: The invention is a modular and hierarchically organized set of computer programs which comprise methods for controlling a system of semi-autonomous automatically guided vehicles, such as mobile robots. The methods include control programs which: execute in stationary control computers; communicate between the stationary control computer programs and corresponding programs which execute in mobile control computers aboard the vehicles; operate independently in mobile control computers aboard the vehicles. The invention allows the system executive program to command the mobile vehicles to start, to stop, to transfer material to or from the vehicles, to change batteries in the vehicles, to park the vehicles at specific points in a factory, to move the vehicles from point to point in a factory, and to remove the vehicles from the factory.

Abstract: A thin reflective cylindrical baffle [20] in a radiant lamp heater is provided in the space below a plurality of heating bulbs [2,4,6] (arranged in a center position and around a middle and outer ring) and above a quartz window [12]. The baffle diameter is such that it fits within the annular space between the middle [4] and outer [6]ring of bulbs. The baffle which blocks a predetermined amount of light generated by the lamp bulbs [20] allows improved controllability of wafer temperature profile--for a wafer heated by a radiant lamp heater.

Abstract: A method of annealing a partially fabricated semiconductor device which comprises the steps of annealing a partially fabricated semiconductor device in an atmosphere of an inert gas and an oxidizing gas. The inert gas is preferably one of nitrogen and argon and the oxidizing gas is preferably one or more of oxygen, hydrogen chloride and nitrogen trifluoride. The oxidizing gas is from about 1 to about 10% by volume of the atmosphere. The annealing step comprises maintaining the partially fabricated semiconductor device at a first temperature, preferably about 700.degree. C., for a first time period, preferably about 20 minutes, ramping up the temperature at a rate to a second temperature, preferably about 800.degree. C., maintaining the second temperature for a second time period, preferably about 20 minutes, ramping up the temperature at a rate, preferably about 10.degree. C./minute, to a third temperature, preferably about 900.degree. C.

Abstract: A semiconductor package device is disclosed. In one embodiment, attached by its active face to a lead-on-chip leadframe having leadfingers is an integrated circuit. The integrated circuit has a polyimide coating on its backside. An encapsulating material surrounds the integrated circuit and the lead-on-chip leadframe so that the leadfingers are exposed. The polyimide coating on the backside of the integrated circuit helps to reduce package cracking arising from mounting the device to a printed circuit board by relflow solder.

Abstract: A low voltage BiCMOS output driver that is operable in a mixed voltage signal environment is provided which comprises a pull-up transistor and blocking circuitry operable to block current flow from the mixed voltage signal environment through the BiCMOS output driver to its supply voltage source.