Patents Represented by Attorney Wall & Tong

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  • Circuit pack cooling solution
    Patent number: 7929306
    Abstract: An improved apparatus and system are provided for heat dissipation in a bank of circuit components using heat pipes and/or vapor chambers, wherein the heat pipes and/or vapor chambers efficiently transport heat away from high heat components.
    Type: Grant
    Filed: March 31, 2009
    Date of Patent: April 19, 2011
    Assignee: Alcatel-Lucent USA Inc.
    Inventors: Domhnaill Hernon, Todd R. Salamon