Abstract: A board turner (1, 31) is intended for use on a conveyor (3) for transporting large volumes of boards. The conveyor (3) defines a plane for carrying boards (14) and the board turner (1, 31) has a rotation unit (4) and a gripping unit (7) mounted on the rotation unit (4). The gripping unit (7) has an open position and a closed position and is switchable between these positions in response to a signal from a sensor. In the open position, the gripping unit (7) rotates past the carrying plane without making contact with the synchronously arriving board (14). A signal from the sensor switches the gripping unit (7) between the open position and the closed position while the gripping unit (7) grips two opposite surfaces of a sideways extending part of the board (14) and continues to rotate above the belt conveyor (3) in order to turn the board (14) in this way.

Abstract: Disclosed is a method of forming a metal interconnection line for a semiconductor device. A metal interconnection line for semiconductor device according to the present invention is formed by the following processes. A semiconductor substrate having a conductive layer thereon is provided and an insulating layer is formed on the semiconductor substrate. A contact hole is formed by etching a selected portion of the insulating layer existing on the conductive layer to expose a predetermined portion of the conductive layer. A barrier metal film is then formed on a surface of the contact hole and the insulating film. A first aluminum alloy film is uniformly formed on the barrier metal film and a metal film for use as a plug is formed on the first aluminum alloy film filling the contact hole wherein the contact hole is covered with the first aluminum alloy film. A contact plug is then formed by etching back the metal film to expose the first aluminum alloy film.