Patents Represented by Attorney Watchstone P & D
  • Patent number: 7253027
    Abstract: A method of manufacturing a hybrid integrated circuit device includes the steps of forming a plurality of units each including a conductive pattern on a surface of a board made of metal, forming grooves along boundaries of the respective units of the board, electrically connecting circuit elements to the conductive patterns in the respective units, separating the respective circuit boards by dividing the board along the grooves, and flattening side surfaces of the circuit boards by pressing the side surfaces.
    Type: Grant
    Filed: December 22, 2004
    Date of Patent: August 7, 2007
    Assignee: Sanyo Electric Co., Ltd.
    Inventor: Masaru Kanakubo
  • Patent number: 7250352
    Abstract: In preferred embodiments, a method of manufacturing a hybrid integrated circuit device is provided, in which a plurality of circuit substrates 10 are manufactured from a single metal substrate 10A? by dicing. In some embodiments, the method includes: preparing a metal substrate 10A? having an insulating layer 11 formed on the top surface thereof; forming a plurality of conductive patterns 12 on the top surface of insulating layer 11; forming grooves 20 in lattice form on the rear surface of metal substrate 10B?; mounting hybrid integrated circuits onto conductive patterns 12; and separating individual circuit substrates 10 with, for example, a rotatable cutter.
    Type: Grant
    Filed: April 24, 2003
    Date of Patent: July 31, 2007
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Masahiko Mizutani, Sadamichi Takakusaki, Motoichi Nezu, Kazutoshi Motegi, Mitsuru Noguchi
  • Patent number: 7232957
    Abstract: An object of the present invention is to provide a method of manufacturing a hybrid integrated circuit device, in which multiple circuit boards are manufactured from one large metal board by dicing. The hybrid integrated circuit device of the present invention includes a circuit board with a surface provided with an insulating layer, and conductive patterns provided on the insulating layer. Circuit elements are electrically connected to the conductive patterns. Further, each side surface of the circuit board includes a first inclined portion extending obliquely downward from a peripheral portion of the surface of the circuit board, and a second inclined portion extending obliquely upward from a back surface of the circuit board and formed to be larger than the first inclined portion.
    Type: Grant
    Filed: September 15, 2004
    Date of Patent: June 19, 2007
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Masahiko Mizutani, Mitsuru Noguchi, Nobuhisa Takakusaki
  • Patent number: 7231307
    Abstract: In some embodiments, a temperature measuring apparatus is provided with a light receiving portion having a plurality of light receiving units for measuring heat quantity of divided temperature detecting area in a noncontact manner, a thermal sensor for detecting temperature of each of the plurality of light receiving units, a calculation portion for calculating a temperature of each of the divided temperature detecting areas based on the temperature obtained by the thermal sensor and the relative temperature difference obtained by the light receiving portion, a correction information holding portion for holding correction information on known reference temperature of the temperature detecting area and its corresponding calculated result outputted from the calculation portion obtained when heat quantity of the temperature detecting area is set to the reference temperature, and a correction portion for correcting the calculated result of the calculation portion based on the correction information.
    Type: Grant
    Filed: August 11, 2005
    Date of Patent: June 12, 2007
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Youji Takei, Masao Tsukizawa
  • Patent number: 7218549
    Abstract: A memory cell and method of destabilizing a memory cell for facilitating a write operation are provided. A stability switch is coupled between one of a voltage supply or a ground terminal and the memory cell, and is turned off during the write operation to reduce the drive voltage required to drive a bit value into the memory cell.
    Type: Grant
    Filed: January 31, 2005
    Date of Patent: May 15, 2007
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Atsushi Kawasumi
  • Patent number: 7213120
    Abstract: A circuit for prevention of unintentional writing to a memory prevents unintentional writing to a nonvolatile memory, after a recovery from a transitory power failure. The circuit includes a low-voltage detection circuit for detecting a power supply voltage drop depending on the state of a control signal for the detection circuit. A writing operation to the memory is prohibited depending on the control signal as well as upon an output signal of the low-voltage detection circuit.
    Type: Grant
    Filed: March 26, 2004
    Date of Patent: May 1, 2007
    Assignee: Sanyo Electric Co., Ltd.
    Inventor: Kazuo Hotaka
  • Patent number: 7206218
    Abstract: A memory cell, including a word line, a bit line, a first node storing a bit value voltage level, a driver transistor coupled between the first node and a ground level, and at least one data transfer transistor having a gate electrode coupled to the word line, a source electrode coupled to the bit line, and a drain electrode coupled to the first node, wherein a channel length of the at least one data transfer transistor is smaller than a channel length of the driver transistor. By making the channel length of a data transfer transistor smaller than that of a driver transistor to which the data transfer transistor is coupled, operation speed and in particular read operation speed of the memory cell is improved, while maintaining memory cell stability.
    Type: Grant
    Filed: January 31, 2005
    Date of Patent: April 17, 2007
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Atsushi Kawasumi
  • Patent number: 7202787
    Abstract: A non-authentic article discrimination system for discriminating whether an article to which an IC tag is attached is a non-authentic article includes an IC tag and a base device. The IC tag includes a first antenna portion for receiving a radio wave, a power generation circuit for generating electric power from the radio wave received by the first antenna portion, a first storing portion for storing information regarding the article, and a radio wave output circuit for outputting a radio wave including the information stored in the first storing portion via the first antenna portion.
    Type: Grant
    Filed: September 29, 2004
    Date of Patent: April 10, 2007
    Assignee: Sanyo Electric Co., Ltd.
    Inventor: Tsutomu Nakazawa
  • Patent number: 7198313
    Abstract: In some illustrative embodiments, a method for the mobile sale of sleeping devices includes: loading display sleeping devices upon a vehicle; driving said vehicle to a consumer; selectively presenting a plurality of said display sleeping devices to said consumer in a display area, whereby said consumer can lay upon said plurality of display sleeping devices to test the same; collecting information from said consumer regarding at least one desired one of said sleeping devices for purchase. In addition, various embodiments are also disclosed that pertain to the selling of furniture or the like items, such as, e.g., sleeping devices, sitting devices and/or the like. Among other things, some embodiments can be used for facilitating the delivery of various goods to consumers.
    Type: Grant
    Filed: December 15, 2003
    Date of Patent: April 3, 2007
    Inventor: Mark L. Baum
  • Patent number: 7173457
    Abstract: A silicon-on-insulator (SOI) sense amplifier for sensing bit values stored in a memory cell, includes first and second input field effect transistors (FETs), connected to first and second cross-coupled CMOS inverter FET pairs. The input FETs are implemented as floating body FETs, which decreases gate capacitances and increases sense operation speed. History effect problems are minimized as threshold voltage differences are kept small.
    Type: Grant
    Filed: January 31, 2005
    Date of Patent: February 6, 2007
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Atsushi Kawasumi
  • Patent number: 7152316
    Abstract: To provide a hybrid integrated circuit device in which the rear surface of a circuit board is exposed to the outside and a method of manufacturing the same. Here, leads are fixed to the surface of the circuit board along one side thereof. A method of manufacturing a hybrid integrated circuit device includes the steps of forming an electric circuit which includes a conductive pattern formed on a surface of a circuit board and a circuit element electrically connected to the conductive pattern, fixing a lead to a pad formed of the conductive pattern, housing the circuit board in a cavity of molds, and fixedly supporting the lead by clamping the lead between the molds, and performing sealing by filling inside of the cavity with sealing resin with the rear surface of the circuit board made in contact with an inside bottom surface of the molds.
    Type: Grant
    Filed: December 22, 2004
    Date of Patent: December 26, 2006
    Assignees: Sanyo Electric Co., Ltd., Kanto Sanyo Semiconductors Co., Ltd.
    Inventors: Haruhiko Mori, Masaru Kanakubo, Hideyuki Sakamoto
  • Patent number: 7119424
    Abstract: A semiconductor device (21) can include, e.g., a recessed portion (25) on the reverse surface (224) of an insulating resin (22) which is the mounting surface of the semiconductor device (21). Additionally, on the outer peripheral surface of the recessed portion (25), the exposed region of leads (26) and the reverse surface (224) of the insulating resin (22) form generally the same plane. This allows, e.g., a QFN semiconductor device (21) according to preferred embodiments herein to place dust particles in the recessed portion (25) even in the presence of dust particles such as crushed burr particles of the leads (26) or plastic burrs, thereby avoiding mounting deficiencies when mounting the semiconductor device.
    Type: Grant
    Filed: June 22, 2004
    Date of Patent: October 10, 2006
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Isao Ochiai, Toshiyuki Take, Tetsuya Fukushima
  • Patent number: 7114540
    Abstract: A pneumatic tire includes main grooves 1 extending substantially in a circumferential direction R of the tire, transverse grooves 2 connecting adjacent main grooves, and blocks 3 formed by adjacent main grooves and adjacent transverse grooves. Each block 3 has an acute corner portion 3a and an obtuse corner portion 3b and also has a groove side extending along the main groove 1 between the acute corner portion 3a and the obtuse corner portion 3b. An inclination angle a1 of the groove side increases from the obtuse corner portion 3b toward the acute corner portion 3a. An extending direction 1a of the main groove 1 at a tread surface level is inclined toward one side of the main groove 1 with respect to the circumferential direction R of the tire, while an extending direction of the main groove 1 at a groove bottom level is inclined toward the other side.
    Type: Grant
    Filed: April 8, 2004
    Date of Patent: October 3, 2006
    Assignee: Toyo Tire & Rubber Co., Ltd.
    Inventor: Tetsuji Miyazaki
  • Patent number: 7104880
    Abstract: A coin feeder (A) comprises a drum-shaped rotating body capable of feeding not only a single size of coins but also different sizes of coins within an allowable range. A coin receiving part (6) and a coin pressing projection (12) pressing a coin (CN) against the coin receiving part (6) are provided at the inner surface of the peripheral wall (2) of the drum-shaped rotating body (1) capable of rotating vertically with a number of coins (CN)(CN) . . . accommodated therein. A coin pressing projection (12) is operated according to the rotation of the dram-shaped rotating body (1) so as to press-hold the coin (CN) against the inner surface of the peripheral wall (2) and release the pressing of the coin at the upper position. Immediately before the coin press-hold state is released, a coin striking member strikes the coin (CN) and the coin pressing projection (12) urges the coin (CN) so as to eject the coin (CN) toward the side of the drum-shaped rotating body (1), i.e., the front of the coin feeder.
    Type: Grant
    Filed: January 19, 2001
    Date of Patent: September 12, 2006
    Assignee: HIMECS Co., Ltd.
    Inventor: Tadanori Maki
  • Patent number: 7094715
    Abstract: A non-halogen series floor material includes a first intermediate resin layer containing filler of 100 to 400 mass parts with respect to resin ingredient of 100 mass parts, the resin ingredient consisting essentially of resin having no chlorine atom in chemical structure, a surface resin layer integrally formed at an upper surface side of the first intermediate resin layer, the surface resin layer containing resin having no chloride atom in chemical structure and having a thickness of 100 to 1,000 ?m, a second intermediate resin layer integrally formed at a lower surface side of the first intermediate resin layer, the second intermediate resin layer containing resin having no chloride atom in chemical structure and filler of 0 to 200 mass parts with respect to resin ingredient of 100 mass parts, and a backing layer integrally formed at a lower surface side of the second intermediate resin layer, the backing layer being formed of a fibrous fabric constituted by fibers containing resin having no chloride atom i
    Type: Grant
    Filed: October 29, 2003
    Date of Patent: August 22, 2006
    Assignee: Suminoe Textile Co., LTD
    Inventors: Eiji Sakaguchi, Makoto Koyama, Junichi Takeda, Yoshiharu Nishino, Hiroaki Ishii
  • Patent number: 7046647
    Abstract: In some illustrative embodiments, a novel system and method is provided that can, for example, extend concepts of pre-authentication (such as, e.g., IEEE 802.11i pre-authentication) so as to operate across networks or subnetworks (such as, e.g., IP subnets). In preferred embodiments, a novel architecture includes one or both of two new mechanisms that substantially improve, e.g., higher-layer handoff performance. A first mechanism is referred to as “pre-configuration,” which allows a mobile to pre-configure higher-layer information effective in candidate IP subnets to handoff. A second mechanism is referred to as “virtual soft-handoff,” which allows a mobile to send or receive packets through the candidate IP subnets even before it is actually perform a handoff to any of the candidate IP subnets.
    Type: Grant
    Filed: January 22, 2004
    Date of Patent: May 16, 2006
    Assignee: Toshiba America Research, Inc.
    Inventors: Yoshihiro Oba, Shinichi Baba
  • Patent number: 6976264
    Abstract: An optical disk adapter can position a deformed CD at a predetermined position in a disk-transferring tray by a very simple operation, and is simple in structure and easy in manufacture. At the central portion of an adapter main body (1a) having an external periphery with the same diameter as a 12 cm-CD, a positioning true circular central aperture (2) in which a square CD (C1) with an 8 cm-diagonal length can be fitted in a non-restricted state is provided. The center of this positioning true central aperture (2) is concentric with the center of the adapter main body (1a). The adapter main body (1a) is provided with a rotation prevention protrusion (3) against the disk-transferring tray (71) at the lower surface thereof and a disk clamper passing dented portion (4) at the upper surface thereof.
    Type: Grant
    Filed: July 27, 2001
    Date of Patent: December 13, 2005
    Assignee: Orient Instrument Computer Co. Ltd.
    Inventor: Masato Murata
  • Patent number: 6956252
    Abstract: In preferred embodiments, a compact a hybrid integrated circuit device 1 can be provided. A conductive pattern 12 is formed on the top surface of a circuit substrate 10, on the top surface of which an insulating layer 11 has been provided. Conductive pattern 12 is formed over the entirety of the top surface of the circuit substrate. Specifically, conductive pattern 12 is also formed at parts within 2 mm from the peripheral ends of circuit substrate 10. Also, a heat sink 13A or other circuit element 13 with some height can be positioned near a peripheral end part of circuit substrate 10. By arranging hybrid integrated circuit device 1, the degree of integration of hybrid integrated circuit is improved. Thus, in a case where the same circuit as a prior-art example is formed, the size of the entire hybrid integrated circuit device can be made small.
    Type: Grant
    Filed: April 24, 2003
    Date of Patent: October 18, 2005
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Masahiko Mizutani, Sadamichi Takakusaki, Motoichi Nezu, Kazutoshi Motegi
  • Patent number: 6948182
    Abstract: The present invention provides a nonstandard-sized optical disc capable of decreasing thickness even when a plurality of optical discs are piled up and assuredly positioning in a disc main body fitting dented portion of a disc player. This optical disc includes a disc main body and an outwardly protruded plate portion protruded outwardly from the disc main body. The outwardly protruded plate portion is formed to have a thickness thinner than that of the disc main body, and the lower portion of the disc main body is formed to have a size to be fitted in the disc main body fitting dented portion in a tray of a disc player. An outer peripheral edge of the lower portion of the disc main body has at least two positioning points to be disposed in the proximity of an inner peripheral edge of the disc main body fitting dented portion to thereby position the disc main body in the disc main body fitting dented portion when the lower portion of the disc main body is fitted in the disc main body fitting dented portion.
    Type: Grant
    Filed: March 22, 2001
    Date of Patent: September 20, 2005
    Inventor: Tomoaki Ito
  • Patent number: 6893176
    Abstract: A label printer suitable for label printing of a name card type optical disk as well as a 12 cm-standard complete round disk, wherein a 12 cm-diameter complete round disk loading recessed portion 3 is provided in a disk transferring tray 2 allowed to be inserted and ejected from a printer body 1, and a name card type disk loading recessed portion 4 having a bottom surface positioned lower than the bottom surface of the complete round disk loading recessed portion 3 is provided at the rear portion of the complete round disk loading recessed portion 3. At a rear portion of the name card type disk loading recessed portion 4, an aperture for allowing the movement of the tip protruded portion 11a of a disk holding means 11 in the fore-and-aft direction of the printer body 1 is provided.
    Type: Grant
    Filed: May 31, 2001
    Date of Patent: May 17, 2005
    Assignee: Orient Instrument Computer Co., Ltd.
    Inventor: Daisuke Obara