Abstract: The present invention relates to an adjustable safety and assistance harnessing device that is mountable to chairs or wheelchairs. Particularly, there is a harness loop (20) which may be attached to one handle (22) of a wheelchair. Additionally, the harness fits under one arm of a person, across the chest and under the other arm of the person. Moreover, the harness may fit under the other handle (34) and over one shoulder of the occupant where the harness is secured to a slideable clip (30). The clip sliding along the chest portion so as to loosen and tighten the harness system. Therefore, the person is free to bend and move more freely in a loosed harness position, and held more securely in a tightened position.

Abstract: An improved method is provided, using existing technology, for treating and disposing of both classified and unclassified waste materials, in a multistage process having a plurality of integrated and interconnected primary and secondary combustion and exhaust systems and having a selective range of pressures and temperatures and fuel/oxygen ratios in each of the systems. The primary or first stage combustion system treats generally classified, predominantly organic waste material that is amenable to a low temperature degradation which produces flammable exhaust materials that are then used to fuel an operably connected high temperature torch which is integral to the secondary or second stage, high temperature combustion system. The high temperature system treats generally unclassified waste material, which may contain both organic and inorganic waste in random ratios.

Abstract: A removable clamping device is described which uniformly and effectively joins two fluid transmission lines at their normal termination points, using standard adapter flanges and removable seals and generally "C" shaped clamps having narrow slots therein which are designed to just slip over the smallest diameter of the adapter or fluid line and bear against the respective connecting flanges. The two clamps are held together by threaded bolts which are spaced equally about the clamps and which may be tightened or loosened without exerting undesirable rotational torque about the long axis of the fluid line connection, thus avoiding possible breakage and leakage.

Abstract: The inventive apparatus is to provide rapid, automatic separation, classification and operator assisted dispensation of integrated circuit assemblies from burn-in and device under test boards to which they are attached. The apparatus is computer controlled, with an electronic control panel, and is assembled to differentiate between and separate physically acceptable and unacceptable integrated circuit assemblies and deliver, by means of a suitable reservoir, the acceptable assemblies to appropriate carrier tubes for further processing or shipping. The system uses an indexing table to move an inverted device under test board across an array of assembly extraction fingers which remove attached integrated circuit assemblies from the sockets of the test board and drop them into a reservoir. The reservoir is slotted to receive the individual assemblies and dispense them into carrier tubes.

Abstract: The inventive apparatus provides for the automated marking, inspecting and handling of a variety of singulated integrated circuit devices. The apparatus includes a computerized high speed vision system with operator touchscreen interface control of a novel series of electrical and mechanical operations to automatically receive integrated circuit devices from a suitable bulk input supply and sequentially inspect, align, mark, inspect, accept or reject, cure and discharge into a suitable bulk output supply, a high volume of properly marked integrated circuit devices, packaged and ready for shipment.

Abstract: A detachable locking device is described which consists of a pair of standard box end wrenches with shortened handles having integral ears on the ends of the handles with openings therethrough. The wrenches are first placed behind the respective connecting nuts on the line termination point adapter assemblies which are to be joined. The preliminary connection and seal is then made using conventional methods and the connecting nuts are torqued to near their optimum value. The box end wrenches of the locking device are then positioned on the nuts so that a connecting bolt can be passed through the openings in the ears on the handles, a nut attached thereto and then tightened to hold and secure the connecting nuts together and prevent the nuts from loosening or seal leaking during the operation of the fluid transmission line.

Abstract: An improved apparatus is described for the closure of the open end of a conventional tube furnace used in the treatment of semiconductor devices manufactured in the integrated circuit industry. The apparatus consists primarily of an adjustable fixed weight on one end of a lever arm and a roller bearing means on the other end, said lever arm being supported by a fulcrum structure which is adjustably attached to the movable track which transports the semiconductor devices into and out of the furnace. The roller bearing end of the lever arm rests with constant pressure against the rear face of the furnace door when the door is closed and held against the opening in the tube furnace. The design eliminates the need for springs and is insensitive to the environment.

Abstract: An improved system for the production of semiconductor devices is described. The invention incorporates conventional, known die attach technology and tape automated bonding technology with known technology for the selective placement of electroconductive material upon a polymer film, which is then enclosed in the same film, to create a system whereby typical integrated circuit die can be simultaneously attached, physically and electrically, to typical lead frames and lead fingers and other lead terminals, to produce a highly reliable integrated circuit, with low inductance between the die and the lead terminals, which may then be encapsulated and trimmed and formed, in known ways, to complete the assembled package.

Abstract: This apparatus provides a means for automatically controlled removal of integrated circuit assemblies from a testing board or other surface where they have been undergoing quality control tests during the IC manufacturing process. The preferred procedure involves passing an inverted standard test board containing a plurality of standard IC assemblies attached thereto, in parallel rows, over a matching array of spring loaded, wedge shaped extraction fingers, which slide into parallel matching slots between the test board sockets and the attached IC assemblies to disengage and separate the IC assemblies from the test board. The loosened assemblies then drop into parallel, matching, down sloping storage reservoirs for transfer to carrier tubes. Misaligned or jammed assemblies displace the spring loaded extraction fingers axially, causing the particular fingers to activate an extraction finger position sensor which then stops the standard mechanical means that moves the test board over the extraction fingers.

Abstract: This invention creates a high speed semiconductor interconnect system which contains a plurality of signal traces, each in a flexible printed circuit, and each adhesively sandwiched between or adjacent to a flexible ground circuit and a flexible power circuit. The signal, power and ground circuits are stacked in multilayers and are connected to respective lead fingers and respective die circuits by standard, known methods such as TAB or wire bond and encapsulated in a known way. The ground plane and power plane being adjacent to the signal plane reduces the power-ground loop inductance and thus reduces the package noise. By reducing the inductance, the circuit can have a shorter switching time. Also, by adding the ground plane, the power-ground capacitance is increased, which serves to reduce the effect of power supply fluctuations in the system.

Abstract: An integrated system is described for testing, marking, inspecting and shipping completed semiconductor integrated circuit parts in a modified standard shipping tray by the combined use of a novel tray cover and an appropriately designed burn-in board assembly. A specially designed tray cover is placed on the modified shipping tray containing multiple integrated circuit parts which have been encapsulated and singulated. The cover is designed to hold the parts securely and precisely in specific individual location. Openings in the cover permit marking and inspecting of the parts by known means, when desired. A burn-in board is appropriately connected to the exposed leads of the parts, from beneath the tray and burn-in and other tests are conducted. Defective parts are identified and replaced. The special cover and burn-in board are removed from the shipping tray, which is then covered with a standard cover or stacked with other completed trays, to be stored or shipped.

Abstract: A new and improved integrated circuit lead frame to be used to reduce bowing during the assembly of conventional microcircuits is described, wherein a conventional die attach paddle is supported on one side by at least one tie bar, extending conventionally between the paddle and the lead finger support structure also known as dam bars, and supported on the opposing side by a plurality of tie bars which are attached on their opposing ends to a novel support beam. This support beam extends between opposing side of the lead frame and provides independent support for the tie bars on the one side and permits dimensional and angular symmetry, similarity and parity to be achieved in the location of all of the tie bars in order to optimize the stability and integrity of the die pad and reduce bowing after the encapsulation process.

Abstract: An improved system for the production of semiconductor devices is described. The invention incorporates conventional die attach and lead bond means into a simplified, common machine system. An independently mounted, computer-controlled, television camera system observes, monitors, and controls the operational steps of the die attach-lead bond process using a close loop process. The invention serves to increase throughout and yields while reducing variation of the finished product.

Abstract: A pneumatically controlled valve system is provided featuring simplified modular construction, reduction of moving parts, improved control of valve operation and increased resistance to corrosive effects of transfer fluid used with the valve. In this invention a 3-way valve system is described which has a valve body constructed of modules of polyvinylidene fluoride polymer (PVDF) removably and operably attached to each other in such a way as to removably contain and retain double diaphragm sliding valve stem assembly of known design which removably seals a fluorocarbon polymer (PTFE) stem to the PVDF seat integral to the valve body to close and open the valve fluid inlet ports and sealingly separates the pneumatic pressurizing gas from the transfer fluid.

Abstract: The present invention relates to a portable gas cylinder safety containment system removably and operably incorporated with a portable, self powered, toxic gas monitoring system, and both removably attached to a delivery cart system, to provide real time monitoring of the delivery cart contents while in transit. This system is designed particularly for the safe transport between storage and work areas of toxic and hazardous gases used in various research, laboratory and production process, such as those in the semiconductor and microcircuit industries.

Abstract: An improved system for the production of semiconductor devices is described. The invention incorporates conventional die attach and wire bond means into a simplified, common machine system. An independently mounted, computer-controlled, television camera system observes, monitors, and controls the operational steps of the die attach wire bond process using a close loop process. The invention serves to increase throughput and yields while reducing variation of the finished product.

Abstract: An improved fuel vaporizing system includes a fuel atomizer, an air vent stabilizer and a fuel pressure regulator serially interconnected within the fuel supply line. The fuel atomizer includes a hot water jacket for receiving heated engine coolant to thus vaporize fuel passing through a coiled conduit within the jacket, and the air vent stabilizer is utilized to provide a smooth liquid fuel flow to the carburetor while preventing vapor lock. The fuel pressure regulator controls the rate of delivery of the fuel to the carburetor. Excess liquid fuel from the air vent stabilizer is passed through a cooling stabilizer before redelivery to the fuel pump.The system may further include a hot water preheater which is thermostatically controlled to supply hot water to the fuel atomizer during that time when the engine block coolant is not sufficiently heated, and an air pump may be provided for supplying heated combustion air to the carburetor with the engine exhaust fumes being employed to heat the combustion air.