Abstract: A lens cap (40) for a transistor outline package includes a lens part (3) and a hollow main part (2) adapted for receiving optoelectronic components. The lens part includes a ball lens (30) having a first groove (27) and a sprue filling portion (31) having a second groove (25). The main part defines an opening (23) which comprises a ball lens receiving hole (231) and a sprue (232). A protruding sidestep (24) is formed along an inner surface of the sprue. The lens part is firmly coupled to the main part through engagement of the protruding sidestep with the second groove and a circular rim (26) of the main part with the first groove. The lens cap is manufactured by insert molding the lens part in the opening, with an injection hole (53) feeding into the sprue. Thus, gluing is avoided, and the ball lens optics are consistently good.
Abstract: An electrical connector (1) includes a housing (10), four signal contacts (20), a pair of power contacts (30) and a shielding (40, 50). The housing has a forwardly extending mating tongue (12). The mating tongue defines four receiving channels (126) therein in a vertical direction and a pair of side surface (122). A groove (128) is defined in each of the side surfaces of the mating tongue. Each signal contact comprises a mating portion (21) retained in a corresponding receiving channel. Each power contact comprises a mating portion (31) retained in a corresponding groove of the mating tongue. The shielding substantially surrounds the housing. The connector has a small dimension and can be used in a portable electronic device.
Abstract: A computer enclosure includes a cage (200) and a drive bracket (100) for pivotably attaching storage devices (300) to the cage. The cage includes a front panel (240), two side panels (260), and two supporting walls (280). Each supporting wall has a rim (281). A guideway (282) is defined in the supporting wall. A guiding entrance (284) defined in the rim separates the rim into front and rear parts. The front part includes a protrusion (288). The drive bracket includes spaces for accommodating the storage devices therein, and two side plates (140) each having a railway (142). Each railway defines a cutout (143). The railways are slidable along the guideways between a first position in which the protrusions are inserted into the cutouts and the storage devices are partly received in the cage and a second position in which the storage devices are fully received in the cage.
Abstract: A system and method for monitoring and controlling transportation of material. The system comprises a central managing device (130), a vehicle information inputting device (110), a material information inputting device (120), a central monitoring device (400), and a global positioning subsystem. Information input through the vehicle information inputting device and the material information inputting device is stored in the central managing device and can be accessed by the central monitoring device. Information on a current location of a vehicle (180) transporting material is sent to a web server (150) via the global positioning subsystem and accessed by the central monitoring device. The central monitoring device can control logistics by checking whether the current location of the vehicle is along a predetermined route of the vehicle.
Type:
Grant
Filed:
June 13, 2002
Date of Patent:
June 22, 2004
Assignee:
Hon Hai Precision Ind. Co., Ltd.
Inventors:
Alex Lee, David Luo, Cheng-Min Hu, Xiaobing Yang
Abstract: A retainer device (30) for securing a CPU (50) to a socket (10) includes a base (32), a clip (36) pivotably attached to a rear of the base, and a crank (34) pivotably attached to a front of the base. The clip has a frame (362), and a pair of supporting flanges (368) and a pair of pressing tabs (369) depending from the frame. A hook (366) depends from a front of the clip. The crank has an offset pressing lever (344) and an operation rod (346). When the operation rod is rotated down toward the socket, the pressing lever drives the hook downwardly. The supporting flanges abut against the base, and the pressing tabs press the CPU. When a heat sink (20) is attached to the CPU, it slightly depresses the CPU, and the CPU is moved downwardly away from contact with the pressing tabs.
Abstract: A method of manufacturing a metal shield of an electrical connector comprises following steps: (a) stamping step to stamp a metal carrier continuously to form a framework having an underside and sidewall; (b) cutting step to cut the underside of the framework out and form a thin edge at the bottom of the sidewall; (c) trimming step to prune the thin edge of sidewall; (d) shaping step to stamp the framework continuously with a punch having chamfers.
Abstract: A modular jack (100) in accordance with the present invention includes an insulative housing (1) defining a cavity for receiving a plug connector, a conductive shield (2) substantially surrounding the insulative housing and a insert assembly (10) installed in the cavity of the insulative housing. The insert assembly includes a magnetic module (3), a first printed circuit board (PCB, 4), a second PCB (5), and a grounding plate (9). A contact array (6) is soldered to the first PCB. The first PCB is attached on a bottom wall (312) of the magnetic module. The second PCB carries capacitors and resistors and a pair of LEDs (501, 502) soldered on a front portion thereof. The second PCB is attached on a top wall (311) of the magnetic module. The magnetic module defines a passageway (38) and the grounding plate has a flat portion (90) received therein.
Type:
Grant
Filed:
October 24, 2002
Date of Patent:
June 22, 2004
Assignee:
Hon Hai Precision Ind. Co., Ltd.
Inventors:
James H. Hyland, Kevin E. Walker, Iosif R. Korsunsky
Abstract: A clip (10) for securing a heat sink (20) to an electronic chip (40) mounted on a socket (30) includes a substantially V-shaped body (11), first and a second legs (14,15) depending from respective opposite ends of the body, and a handle (17) formed at the second leg for facilitating manual operation. The body has a horizontal pressing section (12). Each leg defines a first opening (16) for engagingly receiving a respective projection (32) of the socket. The handle is integrally formed by cutting and bending material from the body and the second leg, and comprises a generally V-shaped body (171) and an operating section (172). The operating section projects out from second leg. Pressing the handle enables the second leg to be resiliently engaged with the corresponding projection of the socket.
Type:
Grant
Filed:
December 4, 2002
Date of Patent:
June 22, 2004
Assignee:
Hon Hai Precision Ind. Co., Ltd.
Inventors:
Hsieh Kun Lee, WanLin Xia, Gencai Wang, Tao Li
Abstract: An electrical connector assembly (1) includes a plug connector (2) and a receptacle connector (3). The plug connector includes an insulative housing (20) defining a number of passageways (205) and a number of electrical contacts (22) received in the passageways and each having a pair of slanted fingers (222). The receptacle connector has an insulative housing (30) defining a number of grooves (306) and a number of electrical contacts (32) formed with slanted resilient arms (322) extending in the grooves. The fingers extend into the grooves to electrically contact with the resilient arms with a low insertion force.
Abstract: An electrical connector (1) mounted to a PCB (3) comprises a bottom housing (4), an upper housing (5) assembled to the bottom housing, a cable (2), a plurality of signal terminals (6) and grounding terminals (7, 8) therein. The bottom housing has a first groove (42) and a plurality of recesses (402). The upper housing has a second groove (52) and a plurality of depressing blocks (500) being respectively aligned with the first groove and the recesses. The cable extends through a cable-receiving groove defined by the first groove and the second groove and has a plurality of wires (20) extended into corresponding recesses at which the depressing blocks apply pressure to the wires for securing the wires in corresponding recesses. Each signal terminal comprises a retention portion (64) disposed in a corresponding recess of the bottom housing and electrically engaging a corresponding wire by insulation displacement connection (IDC), and a tail portion (62) surface mounted to the PCB.
Abstract: A field emission display device (1) includes a cathode plate (20), a resistive buffer (30) in contact with the cathode plate, a plurality of electron emitters (40) formed on the buffer and an anode plate (50) spaced from the buffer. Each electron emitter includes a rod-shaped first part (401) and a conical second part (402). The buffer and first parts are made from silicon oxide (SiOx). The combined buffer and first parts has a gradient distribution of electrical resistivity such that highest electrical resistivity is nearest the cathode plate and lowest electrical resistivity is nearest the anode plate. The second parts are made from molybdenum. When emitting voltage is applied between the cathode and anode plates, electrons emitted from the second parts traverse an interspace region and are received by the anode plate. Because of the gradient distribution of electrical resistivity, only a very low emitting voltage is needed.
Abstract: A field emission display device (1) includes a cathode plate (20), a resistive buffer (30) in contact with the cathode plate, a plurality of electron emitters (40) formed on the buffer and an anode plate (50) spaced from the buffer. Each electron emitter includes a rod-shaped first part (401) and a conical second part (402). The buffer and first parts are made from silicon nitride (SiNx). The combined buffer and first parts has a gradient distribution of electrical resistivity such that highest electrical resistivity is nearest the cathode plate and lowest electrical resistivity is nearest the anode plate. The second parts are made from molybdenum. When emitting voltage is applied between the cathode and anode plates, electrons emitted from the second parts traverse an interspace region and are received by the anode plate. Because of the gradient distribution of electrical resistivity, only a very low emitting voltage is needed.