Abstract: An apparatus for controlling operation of a processing machine has a computer preferably with a computer aided design program configurable to model a kinematic velocity profile of a point of interest on a machine to be controlled. A graphical user interface on the computer enables an operator to select desired velocity points for a motor drive controlling motion of the point on the machine. A curve fit is applied to the velocity points to realize a desired velocity profile for the motor drive and the point on the machine. The desired velocity profile is then integrated and scaled in order to obtain a scaled velocity profile that realizes an actual, or target displacement of the point as dictated by operation of the machine. By controlling operation of elements of a machine with velocity profiles, coordination of associated elements and points on the machine can be visualized by an operator selecting the velocity points for each drive of the machine. A method for implementing same is also disclosed.

Abstract: A semiconductor wafer processor includes a chamber having a wafer support. A magnetic field generator is configured to generate a magnetic field within the chamber at a location proximate a surface of a wafer received by the wafer support. The magnetic field generator comprises a plurality of conductors within the chamber proximate the support which radiate outwardly from a substantially common origin to a periphery. The origin and periphery can be in the same or multiple planes. In one embodiment, the magnetic field generator includes a first plurality of conductors radiating outwardly from a first origin to a first periphery, and a second plurality of conductors annularly radiating outwardly from an annular second origin to an annular second periphery. The first periphery is received at least partially within the second annular periphery. The generator can be utilized apart from a semiconductor wafer processor, such as for example in an electric motor or plasma generating apparatus.