Abstract: A method for polishing a substrate having a metal film thereon is described. The substrate has metal interconnects formed from part of the metal film. The polishing method includes performing a first polishing process of removing the metal film, after the first polishing process, performing a second polishing process of removing the barrier film, after the second polishing process, performing a third polishing process of polishing the insulating film. During the second polishing process and the third polishing process, a polishing state of the substrate is monitored with an eddy current sensor, and the third polishing process is terminated when an output signal of the eddy current sensor reaches a predetermined threshold.

Abstract: In a laminated heat exchanger, an intake portion and an outlet portion for heat exchanging medium are provided at one end portion in the direction of lamination. The intake portion is made to communicate with a most upstream pass distance from the one end portion in the direction of lamination via a communicating pipe, and the outlet portion is made to communicate with the most downstream pass at one end portion in the direction of lamination. The communicating pipe is further made to communicate with an odd-numbered pass in the vicinity where the odd-numbered pass changes from the even-numbered pass that immediately precedes it. In addition, the intake portion at one end portion in the direction of lamination is made to communicate with the pass immediately preceding the most downstream pass.