Abstract: A method for manufacturing a laminated core includes (1) blanking a rotor core sheet 15 and a stator core sheet 14 from a thin strip material 27 and (2) laminating the stator core sheet 14 inside a die. The stator core sheet 14 includes a ring-shaped yoke piece 18 and plural magnetic pole pieces 19 integrally connecting to a radially inside of the yoke piece 18. Each of the magnetic pole pieces 19 includes a magnetic pole shaft piece 20 and a magnetic pole tooth piece 21. The magnetic pole pieces 19 are formed by blanking preparatory slots 29; coining a part or a whole of the magnetic pole shaft pieces 20 to elongate the same in a radially inward direction; and thereafter, blanking the finishing slots 30 and shaping the magnetic pole tooth pieces 21.

Abstract: An image pickup system including an image pickup device and a connection device is provided. The image pickup device includes an image pickup unit which picks up a subject image, a display unit, a first character image generation unit, and a first control unit. The first character image generation unit generates a first character image representing one or more characters to be displayed on the display unit. The first control unit outputs the subject image and information representing the above-noted one or more characters to the connection device when the image pick-up device and the connection device are connected with each other. The connection device includes a second character image generation unit. The second character image generation unit generates a second character image representing one or more characters to be displayed on an external display device, based on the information representing the above-noted one or more characters.

Abstract: A gate electrode made of semiconductor is formed on the partial surface area of a semiconductor substrate. A mask member is formed on the surface of the semiconductor substrate in an area adjacent to the gate electrode. Impurities are implanted into the gate electrode. After impurities are implanted, the mask member is removed. Source and drain regions are formed by implanting impurities into the surface layer of the semiconductor substrate on both sides of the gate electrode. It is possible to reduce variations of cross sectional shape of gate electrodes and set an impurity concentration of the gate electrode independently from an impurity concentration of the source and drain regions.

Abstract: The evaluation method of a separator for a nonaqueous electrolyte battery according to the present invention includes: placing opposite an upper jig 21 serving also as a conductive electrode and a lower jig 23 serving also as a conductive electrode in both sides of the separator sample 22; and measuring the relationship between an applied voltage and a passed current between the upper jig 21 and the lower jig 23 while applying a pressure to between the upper jig 21 and the lower jig 23 to evaluate the separator. At this time, by fitting a foreign material 28 in any shape between the separator sample 22 and one of the upper jig 21 and the lower jig 23, an evaluation of the separator simulating the presence of a foreign material affecting adversely the separator can be performed.

Abstract: The present invention relates to a liquid cleaner for a semiconductor substrate on which metal wiring may be provided, comprising each component of a chelating agent or a salt thereof shown by the following general formula (1), an alkaline compound and pure water, wherein pH is 8 to 13: (wherein, Y1 and Y2 are lower alkylene groups, n is an integer of 0 to 4, at least 4 of R1 to R4 and n R5s are alkyl groups having phosphonic acid group(s) and the rest are alkyl groups) and a cleaning method using the same. The present invention provides a liquid cleaner which can efficiently remove fine particles or impurities derived from various metals at semiconductor substrate surface, even when used after a process adopting an alkaline polishing agent or alkaline etching liquid, without generating problems of causing difficult-to-remove gelled particles at the substrate surface or easy generation of rough semiconductor substrate surface, and a cleaning method using the same.

Abstract: A variable valve system includes a transmission mechanism T which transmits a valve actuating force to an inlet valve 11 and which varies a maximum lift amount of the inlet valve 11 and biasing members 60. A sub-cam 40 oscillatably supported on a holder 30 driven by a control member 70 has a roller 43 contacting the inlet cam 15a, a drive cam portion 46 outputting the valve actuating force, and acting portions A contacting the biasing members 60. The acting portions A are provided in the vicinity of the roller 43 so that biased contact points 45a1, 45b1 are positioned nearer to a cam contact point 43a than an oscillation center line Ls and that an acting line L1 of a biasing force is superposed on the roller 43 as viewed in the direction of the oscillation center line Ls.

Abstract: Designing method of an electronic device subjected to a chemical mechanical polishing process in a fabrication process thereof is conducted according to the steps of: dividing a substrate surface into first sub-regions; optimizing a coverage ratio of hard-to-polish regions in the first sub-regions to fall in a first predetermined range corresponding to the first sub-regions; dividing the substrate surface into second sub-regions different from the first sub-regions; and optimizing a coverage ratio of the hard-to-polish regions in the second sub-regions to fall in a second predetermined range corresponding to the second sub-regions, wherein patterns having a shorter edge of 5 ?m or less are excluded from the optimization.

Abstract: A method for fabricating a semiconductor device comprises the steps of: forming interconnection grooves 38 in an inter-layer insulation film 34; forming an interconnection layer 44 of Cu as the main material in the interconnection grooves 38; and concurrently injecting nitrogen gas and water to the surface of the interconnection layer 44 buried in the interconnection groove 38.

Abstract: In a hydraulic style vibration-proof device, a lower attachment fitting (34) forming an air chamber (36) between a diaphragm (16) and itself is fabricated of aluminum and is provided at its bottom wall portion with a through-hole (50), and a bolt (52) having a serration portion (54) below its head is press fitted in and secured to the through-hole, thereby fixedly providing the bolt (52) without involving a large projection into the air chamber (36) and at a low cost Further, the bottom wall portion (34B) is formed to be thicker than a peripheral wall portion (34C) of the lower attachment fitting and both are interconnected by a curved portion (34D), thereby achieving an increase in strength.

Abstract: A disc apparatus (10) includes an optical lens (14). A laser beam is irradiated onto a recording surface of the magneto-optical disc (68) through the optical lens (14), and a TE signal or an RF signal is detected on the basis of the laser beam reflected by the recording surface. Herein, an MPU (50) replaces the optical lens (14) in an optical axis direction, and a TE signal detection circuit (42) or an RF signal detection circuit (60) detects the TE signal or the RF signal at each of lens positions. A laser power is adjusted by the MPU (50) such that amplitude of each of the TE signal or the RF signal detected is below a saturation value. When a parameter is adjusted, a position of the optical lens (14) is controlled such that the amplitude of the TE signal or the RF signal detected thereafter is maximized.

Abstract: A substrate sheet material for semiconductor device and manufacturing method thereof and a manufacturing method of a semiconductor device using the substrate sheet material can suppress and reduce a warp which may occur in the substrate sheet material even when a plurality of semiconductor chips formed in the substrate sheet material are molded all at once. A plurality of substrates to be used for producing semiconductor packages are formed in the substrate sheet material. An outer configuration of the substrate sheet material is made into a circular shape.

Abstract: A lithography system of in-line type includes environment sensors disposed within a chamber in which an exposure apparatus body is housed and a chamber in which a coater/developer body is housed. During a lithography process, on the basis of measured values such as air pressure temperature and humidity measured by the environment sensors, and environment control portion controls air conditioning portions in such a manner that the environmental conditions in the chambers becomes substantially the same as each other. Whereby, even when a wafer is transferred through a connecting portion, the environmental conditions in the chambers do not badly influence each other.

Abstract: The present invention pertains to a transparent conductive layered structure having a transparent substrate and a transparent 2-layer film consisting of a transparent conductive layer and a transparent coating layer formed in succession on this substrate, that is used for instance, in the front panel of displays, such as CRTs, etc. The above-mentioned transparent conductive layer has as its main components noble metal microparticles with a mean particle diameter of 1 to 100 nm composed of gold and/or platinum and silver and containing 5 to 95 wt % gold and/or platinum, colored pigment microparticles with a mean particle diameter of 5 to 200 nm, and binder matrix. The noble metal microparticles are mixed at a ratio of 1 to 40 parts by weight per 1 part by weight colored pigment microparticles. Moreover, it is characterized in that the transparent 2-layer film has a surface resistance of 10 to 5000 &OHgr;/□, reflectance of 0 to 2.