Abstract: In the chip layout of an LSI, a layout near bonding pads is efficiently optimized. Especially in a chip having a large number of pins, an increase in chip size caused by pad necks can be prevented. Normal functional macro-blocks are arranged in an inner region of the LSI. On the other hand, input/output blocks including corner blocks are arranged at the peripheral portion of the LSI. In addition, pads separated from the input/output blocks are arranged on the LSI including portions near the corner blocks, and the input/output blocks and the pads are connected to each other through wiring lines.