Patents Represented by Law Firm Whitham, Curtis, Whithman & McGinn
  • Via-structure of a multilayer interconnection ceramic substrate
    Patent number: 5576518
    Abstract: A via-structure off a multilayer interconnection ceramic substrate for a multi-chip module, a semiconductor package and an insulating substrate has a high strength and a high reliability being produced at a low cost. A gap is provided at an interface between a via-conductor and ceramics, and filled with a resin. The resin is preferably of a thermosetting polyimide resin or a benzo-cyclo-butene resin.
    Type: Grant
    Filed: May 12, 1995
    Date of Patent: November 19, 1996
    Assignee: NEC Corporation
    Inventors: Akinobu Shibuya, Mitsuru Kimura