Abstract: Vibration or acoustic sound control is achieved using an elastic layer of thermal or insulation material in which a plurality of discrete masses are distributed throughout. The elastic layer may be installed as a pre-formed layer, or be blown into position within a structure where vibration or acoustic sound control is required.

Abstract: Enhanced carrier mobility in transistors of differing (e.g. complementary) conductivity types is achieved on a common chip by provision of two or more respective stressed layers, such as etch stop layers, overlying the transistors with stress being wholly or partially relieved in portions of the respective layers, preferably by implantations with heavy ions such as germanium, arsenic, xenon, indium, antimony, silicon, nitrogen oxygen or carbon in accordance with a block-out mask. The distribution and small size of individual areas of such stressed structures also prevents warping or curling of even very thin substrates.