Abstract: A carrier for a leadless integrated circuit chip has a cavity into which a chip is laterally inserted through an opening in a side wall of the carrier. A spring arm formed integrally with the carrier flexes backward in a recess to permit insertion of the chip, which has a plurality of electrical contact pads on its upper surface, and then bears against the chip under an internal spring bias to retain it within the cavity. Tabs at the upper corners of the cavity are positioned over the corners of the chip which are free of electrical contact pads, thereby preventing the chip from escaping while exposing the pads for both single and dual pin probing. The external configuration of the carrier conforms to industry standards so that the chip can be fully processed and tested without removing it from the carrier.