Abstract: A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin.

Abstract: A vacuum fixture incorporating a vacuum suctioning device which may be employed in the manufacture of thin film chip carriers through the intermediary of retaining parts which are to be processed on the surface of a suction plate in a dimensionally compensating operative mode. A process is disclosed which may be employed in the manufacture of thin film chip carriers which is adhered in a dimensionally compensating manner to the surface of an interposer plate which is supported on a suction plate of a vacuum fixture.