Patents Represented by Attorney William H. Steinberg
  • Patent number: 6943767
    Abstract: An image display device where electrical potential is provided by time divisons from one display signal line to two or more pixels situated adjacent to one another in an LCD matrix. During one horizontal scanning period an electric potential from the display signal line is written to the first and second pixel electrode during a time period TA. During a time period TB an electric potential, which may be different from the electric potential provided in time period TA, is written to the second pixel electrode. Time period TA is adjusted to be longer than time period TB.
    Type: Grant
    Filed: December 12, 2002
    Date of Patent: September 13, 2005
    Assignee: International Business Machines Corporation
    Inventors: Kazuhiro Abe, Eisuke Kanzaki, Manabu Kodate
  • Patent number: 6931726
    Abstract: A method of making an interconnect structure having an increased chip connector pad and plated through hole density is provided. In particular, the method includes the steps of providing a substrate having at least one plated through hole therein, and positioning a first conductive layer and a second conductive layer over the at least one plated through hole on opposing surfaces of the substrate. The method includes positioning a layer of dielectric material thereon on the first conductive layer. The dielectric layer includes at least one aperture selectively positioned directly over the at least one plated through hole. The substrate further includes a metal layer, and at least a pair of conductive layers that can carry signals, and power.
    Type: Grant
    Filed: May 13, 2003
    Date of Patent: August 23, 2005
    Assignee: International Business Machines Corporation
    Inventors: Christina M. Boyko, Donald S. Farquhar, Konstantinos I. Papathomas
  • Patent number: 6914467
    Abstract: A method and device program a dual edge programmable delay unit, that responds to an input signal with a rise time and a fall time, includes a buffer which receives the input signal and provides an output signal with programmed variable delays between the rise and fall times of the output signal. Programmable control sources (PCS) provide separate control inputs to a buffer. The FTPCS charges a capacitor in the buffer when the input signal changes from high to low to adjust time delay before the fall of the buffer output signal. The RTPCS discharges the capacitor in the buffer when the input signal changes from low to high to adjust time delay before the rise of the buffer output signal.
    Type: Grant
    Filed: December 4, 2003
    Date of Patent: July 5, 2005
    Assignee: International Business Machines Corporation
    Inventors: Kai D. Feng, Hongfei Wu
  • Patent number: 6908855
    Abstract: A plating tail connected to a signal trace for use during an electroplating operation is fabricated such that it has a substantially different impedance from the signal trace at a characteristic frequency in use, so that adverse reflections during operation are reduced below a threshold of significance.
    Type: Grant
    Filed: October 19, 2004
    Date of Patent: June 21, 2005
    Assignee: International Business Machines Corporation
    Inventors: Mark J. Kuzawinski, Edward M. Wolf
  • Patent number: 6893897
    Abstract: A space-saving integrated circuit package employs two printed circuit boards joined together, the upper board having an integrated circuit attached by flip-chip technology and the lower board having a cavity for holding an integrated circuit that is located beneath the upper integrated circuit, the lower integrated circuit being bonded to the bottom of the upper board below the upper integrated circuit and electrically connected to wiring on the lower surface of the lower board by wire bond connections.
    Type: Grant
    Filed: January 29, 2004
    Date of Patent: May 17, 2005
    Assignee: International Business Machines Corporation
    Inventor: Jennifer R. Sweterlitsch
  • Patent number: 6887651
    Abstract: A hybrid photolithography process for printed circuit board patterning combines two types of photoresist applications to achieve superior protection of printed circuit board (PCB) ‘plated through holes’ (PTH). In a first step, electro-deposited (ED) photoresist (also known as “ED resist”) is applied to a fully copper plated PCB including the ‘plated through holes’ to protect the outer layers and the ‘plated through holes’ from copper etchant solution. In a second step, the electro-deposited photoresist is imaged (exposed) and patterned (developed). In a third step, after developing the circuit image, a layer of Dry Film resist is applied to the panel of the PCB on top of the developed electro-deposited (ED) photoresist. This Dry Film resist layer will ‘tent’ the plated through holes by adding an extra layer of protection to the plated through holes. In a fourth step, the dry film resist is then exposed and developed. At this point, the PCB is etched as normal and all subsequent processing remains unchanged.
    Type: Grant
    Filed: November 25, 2002
    Date of Patent: May 3, 2005
    Assignee: International Business Machines Corporation
    Inventors: Ashwinkumar C. Bhatt, Brant S. Blomberg, Ross W. Keesler, Michael V. Longo, Eboney J. N. Smith
  • Patent number: 6874001
    Abstract: A method, an apparatus, a system, a computer program product, and a computer program are disclosed for maintaining consistency of object content (252) and metadata (204) related to the object (252) in a loose transaction model, preferably using SQL Mediated Object Manipulation (SMOM), for object and meta-data updates. The related meta-data (204) and a reference to the object (252) are stored in a table of a database. The object is stored externally to the database in an object store. The reference is used to obtain a handle for directly accessing or manipulating the external object. A version number embedded in the handle is then obtained. The embedded version number is then compared with a version number of a latest committed version of the externally stored object to determine if the handle refers to a current version of the externally stored object.
    Type: Grant
    Filed: October 5, 2001
    Date of Patent: March 29, 2005
    Assignee: International Business Machines Corporation
    Inventors: Inderpal Singh Narang, Karen Wolfe Brannon, Suparna Bhattacharya, Hui-I Hsiao
  • Patent number: 6856270
    Abstract: A pipeline array includes a register, a pipeline clock input, and Narrow Pulse Triggered Latches (NPTL) stages connected in series. Each NPTL stage includes a Latch Pulse Generator (LPG) and a parallel set of single latches clocked by the LPG. The latches provide the parallel data input and the parallel data output of the stage. Each LPG provides a narrow latch clock pulse in response to a Pipeline Clock Pulse (PCP) supplied to the register and the last stage of latches. Each PCP arrives at each preceding LPG in the array after a delay provided by intervening time delay units. The delays increase for each preceding stage with the least delay at the penultimate stage and with the greatest delay at the first stage. The data input of the first stage is connected to the output of the register. The data input of the each of other stage is connected to the data output of the preceding stage in the array.
    Type: Grant
    Filed: January 29, 2004
    Date of Patent: February 15, 2005
    Assignee: International Business Machines Corporation
    Inventors: Henry R. Farmer, David E. Lackey, Steven F. Oakland
  • Patent number: 6836312
    Abstract: To provide an optically transparent film, a method of manufacturing the optically transparent film, an alignment film formed of the optically transparent film, and a liquid crystal panel and a display including the alignment film. The optically transparent film includes amorphous fluorocarbon. Preferably, the integrated transmittance of the optically transparent film is in the visible region is about 50% or higher when the optically transparent film has a film thickness of about 100 nm. The amorphous fluorocarbon has an atomic ratio between hydrogen atoms and fluorine atoms of about 1/9 or higher, and the transmittance in the visible region can be controlled by controlling the atomic ratio of fluorine atoms.
    Type: Grant
    Filed: September 6, 2002
    Date of Patent: December 28, 2004
    Assignee: International Business Machines Corporation
    Inventor: Yoshimine Kato
  • Patent number: 6832436
    Abstract: A method for forming a substructure or an electrical structure. To form the substructure, a sheet of conductive material having exposed first and second surfaces is provided. A hole is formed through the sheet of conductive material. A first layer of dielectric material is applied to the exposed first surface, after the forming the hole. No material was inserted into the hole before applying the first layer of dielectric material to the exposed first surface. To form the electrical structure, a multilayered laminate that includes a plurality of substructures is formed such that a dielectric layer insulatively separates each pair of successive substructures.
    Type: Grant
    Filed: March 7, 2002
    Date of Patent: December 21, 2004
    Assignee: International Business Machines Corporation
    Inventors: Donald O. Anstrom, Bruce J. Chamberlin, James W. Fuller, Jr., John M. Lauffer, Voya R. Markovich, Douglas O. Powell, Joseph P. Resavy, James R. Stack
  • Patent number: 6830960
    Abstract: A stress-relieving heatsink structure and method of forming thereof for an electronic package, for instance, that including a semiconductor chip package which is mounted on a wired carrier, such as a circuitized substrate. The heatsink structure is constituted from a plurality of base structures which are joined along slits so as to impart a degree of flexibility to the electronic package inhibiting the forming of stresses tending to cause delamination of the package components.
    Type: Grant
    Filed: August 22, 2002
    Date of Patent: December 14, 2004
    Assignee: International Business Machines Corporation
    Inventors: David J. Alcoe, Randall J. Stutzman
  • Patent number: 6831931
    Abstract: A transport demultiplexor system and queue remultiplexing methodology includes: a packet buffer for receiving data packets belonging to an input transport stream, each packet having a corresponding identifier identifying a program to which the packet belongs; a data unloader device for pulling successive packets from the packet buffer for storage in a memory storage device, and writing the pulled packets into contiguous address locations in the memory; and, a remultiplexor mechanism for generating an address offset associated with a next data packet pulled from the packet buffer to be stored in memory and writing it to a new memory location that is offset from a memory location assigned to a previously pulled packet, the offset defining a memory gap in the memory storage device capable of being filled new data content.
    Type: Grant
    Filed: December 6, 2000
    Date of Patent: December 14, 2004
    Assignee: International Business Machines Corporation
    Inventors: David Coupe, Eric M. Foster, Bryan J. Lloyd, Chuck H. Ngai
  • Patent number: 6829823
    Abstract: A method of making a multi-layered interconnect structure. First and second electrically conductive members are formed on the first and second dielectric layers, respectively. The dielectric layer are formed on opposing surfaces of a thermally conductive layer. A first and second electrically conductive layer is formed within the first dielectric layer. The second electrically conductive layer includes shielded signal conductors and is positioned between the first electrically conductive layer and the thermally conductive layer. A plated through hole (PTH) formed through the interconnect structure is electrically connected to one of the first and second electrically conductive members and to one of the shielded signal conductors.
    Type: Grant
    Filed: February 5, 2002
    Date of Patent: December 14, 2004
    Assignee: International Business Machines Corporation
    Inventors: Francis J. Downes, Jr., Donald S. Farquhar, Elizabeth Foster, Robert M. Japp, Gerald W. Jones, John S. Kresge, Robert D. Sebesta, David B. Stone, James R. Wilcox
  • Patent number: 6830875
    Abstract: A method for forming an electronic structure. Provides is a layer that includes a cylindrical volume of a photoimageable dielectric (PID) material, an annular volume of the PID material circumscribing the cylindrical volume, and a remaining volume of the PID material circumscribing the annular volume. The layer is photolithograhically exposed to radiation. The annular volume is fully cured by the radiation. The remaining volume is partially cured by the remaining volume by said radiation. The method prevents curing of the cylindrical volume, wherein the PID material in the cylindrical volume remains uncured.
    Type: Grant
    Filed: October 7, 2002
    Date of Patent: December 14, 2004
    Assignee: International Business Machines Corporation
    Inventors: Stephen J. Fuerniss, Gary Johansson, Ross W. Keesler, John M. Lauffer, Voya R. Markovich, Peter A. Moschak, David J. Russell, William E. Wilson
  • Patent number: 6829144
    Abstract: A chip package is provided with multiple ways of attaching a heat sink directly to the chip carrier. Corner post are mounted to the surface of the chip carrier. A heat spreading plate, with a surface area substantially the same size as the surface area of the chip carrier, is positioned in thermal contact with the surface of a flip chip, for example. The heat spreading plate has corner cuts to accommodate the corner posts of the chip carrier and notches cut into at least two opposing sides. A heat sink plate with holes extending therethrough at each of its four corners is positioned to allow the corner posts of said chip carrier to extend therethrough. Notches cut in two opposing sides of said heat sink plate are aligned with the notches in said heat spreading plate to create slots for a flexible clip to clamp the assembly together. Alternatively, nuts may also be threaded onto the posts to clamp the assembly together.
    Type: Grant
    Filed: August 5, 2003
    Date of Patent: December 7, 2004
    Assignee: International Business Machines Corporation
    Inventors: Randall J. Stutzman, Jamil A. Wakil
  • Patent number: 6826830
    Abstract: A multi-layered interconnect structure and method of formation. In a first embodiment, first and second liquid crystal polymer (LCP) dielectric layers are directly bonded, respectively, to first and second opposing surface of a thermally conductive layer, with no extrinsic adhesive material bonding the thermally conductive layer with either the first or second LCP dielectric layer. In a second embodiment, first and second 2S1P substructures are directly bonded, respectively, to first and second opposing surfaces of a LCP dielectric joining layer, with no extrinsic adhesive material bonding the LCP dielectric joining layer with either the first or second 2S1P substructures.
    Type: Grant
    Filed: October 3, 2002
    Date of Patent: December 7, 2004
    Assignee: International Business Machines Corporation
    Inventors: Frank D. Egitto, Donald S. Farquhar, Voya R. Markovich, Mark D. Poliks, Douglas O. Powell
  • Patent number: 6823015
    Abstract: A technique is provided for encoding macroblocks of a frame of a sequence of video frames initially employing luminance data only to analyze temporal redundancy of the macroblocks within the frame. Upon deciding to code at least one macroblock as a non-intra macroblock, the technique includes considering whether to switch the coding decision for the at least one macroblock from non-intra to intra by evaluating chrominance data of the at least one macroblock. The evaluating of the chrominance data can include determining whether chrominance difference data, obtained by comparing chrominance values of a current macroblock with a reference macroblock, is greater than a user set chrominance difference threshold, and if so then the technique includes switching the macroblock coding decision. As a further qualification, the switching might occur only if the chrominance difference data is also greater than the corresponding luminance difference data.
    Type: Grant
    Filed: January 23, 2002
    Date of Patent: November 23, 2004
    Assignee: International Business Machines Corporation
    Inventors: Barbara A. Hall, Agnes Y. Ngai, John M. Sutton, Edward F. Westermann
  • Patent number: 6823013
    Abstract: An apparatus used for video encoding MPEG compliant digital visual images, having multiple MPEG encoders used in the motion estimation function. The search capabilities used in the motion estimation function of a single MPEG encoder are extended beyond its design limitations as a result of utilizing more than one MPEG encoder. The utilization of multiple encoders effectively creates the capability for a user to specify a wider search window than what is available in a single encoder configuration. The computational search efficency associated with searching the wider window is not adversely affected as a consequence of the multiple processors subdividing the extended window and analyzing each subdivision in parallel.
    Type: Grant
    Filed: March 23, 1998
    Date of Patent: November 23, 2004
    Assignee: International Business Machines Corporation
    Inventors: Charles E. Boice, John A. Murdock, Agnes Y. Ngai
  • Patent number: 6822332
    Abstract: A circuitized substrate and a method of making the circuitized substrate is provided. The circuitized substrate includes a substrate having a substantially planar upper surface and a conductive layer positioned on the substantially planar upper surface. The conductive layer includes at least one side wall therein, defining an opening in the conductive layer. The conductive layer includes an end portion spaced from the opening, the end portion forming an acute angle with the substantially planar upper surface of the substrate. The at least one side wall is substantially perpendicular to the substantially planar upper surface of the substrate.
    Type: Grant
    Filed: September 23, 2002
    Date of Patent: November 23, 2004
    Assignee: International Business Machines Corporation
    Inventors: Frank D. Egitto, Kevin T. Knadle, Andrew M. Seman
  • Patent number: 6819841
    Abstract: An apparatus for self-aligning an optical fiber to an optical waveguide. The apparatus includes an optical waveguide chip including: one or more optical waveguides formed on a first substrate, each optical waveguide having a protruding portion; and one or more alignment rails formed on the first substrate, each alignment rail spaced apart from each optical waveguide by a predetermined distance; and an alignment jig including: one or more grooves formed in a second substrate, each groove adapted to receive one protruding portion and each groove supporting one optical fiber in alignment with one optical waveguide; and one or more alignment grooves formed on the second substrate, each alignment groove spaced apart from the grooves by the predetermined distance and adapted to mate with the alignment rails.
    Type: Grant
    Filed: August 29, 2002
    Date of Patent: November 16, 2004
    Assignee: International Business Machines Corporation
    Inventors: Roland Germann, David V. Horak, Akihisa Sekiguchi