Abstract: The present application describes an electronically powered postage stamp or mailing label and including a radio frequency identification (RFID) device and system mounted between the opposing and facing major surfaces thereof. The RFID device and system includes an integrated circuit transceiver chip which is connected to and powered by a thin flat battery cell and is operated with a thin film RF antenna, all of which are mounted in side-by-side relationship on a thin base or support layer. These thin flat components are mounted in an essentially two dimensional planar configuration well suited for incorporation into the planar structure of a postage stamp or a mailing label. In addition, the RFID transceiver chip may be replaced with an electro-optically operated IC chip using, for example, LEDs or laser diodes for the propagation of light signals to an interrogator.

Abstract: The present application describes an electronically powered postage stamp or mailing label and including a radio frequency identification (RFID) device and system mounted between the opposing and facing major surfaces thereof. The RFID device and system includes an integrated circuit transceiver chip which is connected to and powered by a thin flat battery cell and is operated with a thin film RF antenna, all of which are mounted in side-by-side relationship on a thin base or support layer. These thin flat components are mounted in an essentially two dimensional planar configuration well suited for incorporation into the planar structure of a postage stamp or a mailing label. In addition, the RFID transceiver chip may be replaced with an electro-optically operated IC chip using, for example, LEDs or laser diodes for the propagation of light signals to an interrogator.

Abstract: The present application describes an electronically powered postage stamp or mailing label and including a radio frequency identification (RFID) device and system mounted between the opposing and facing major surfaces thereof. The RFID device and system includes an integrated circuit transceiver chip which is connected to and powered by a thin flat battery cell and is operated with a thin film RF antenna, all of which are mounted in side-by-side relationship on a thin base or support layer. These thin flat components are mounted in an essentially two dimensional planar configuration well suited for incorporation into the planar structure of a postage stamp or a mailing label. In addition, the RFID transceiver chip may be replaced with an electro-optically operated IC chip using, for example, LEDs or laser diodes for the propagation of light signals to an interrogator.

Abstract: A method for probe testing and burning-in integrated circuits formed within dice or chips on a silicon wafer and then optionally either: (1) dicing the wafer into individual chips for shipment or (2) mating the wafer for shipment with a facing substrate having a temperature coefficient of expansion (TCE) matching the TCE of the wafer. Advantageously, the facing substrate is used for both probe and burn-in operations as well as being made a part of the wafer package in option No. 2 above where either the whole silicon wafer or a partial silicon wafer meeting threshold die requirements is to be shipped. In addition, probe and burn-in operations are carried out rapidly at high yields only after all integrated circuit manufacture has been completed.

Abstract: DRAM read accessing circuitry having two parallel connected control lines, one of which includes a level translator stage and the other of which includes an enable gate. Both the level translator stage and the enable gate are connected to receive 0.0 to 3 volt small logic swings from output buffer logic utilized in reading data out of the DRAM. Output signals from the level translator stage are applied to a pull up output transistor in an output driver stage, and output signals from the enable gate are connected to a pull down output transistor in the output driver stage. A feedback connection is provided between the output of the level translator stage and one input to the enable gate to ensure that the enable gate does not generate an enabling output signal for turning on the pull down output transistor until the pull up output transistor is completely turned off.

Abstract: Highly conformal layers of either titanium, Ti, titanium nitride, TiN, or titanium oxide, TiO.sub.x, are formed on exposed surfaces of silicon substrates by first forming a very thin chemical vapor deposition (CVD) layer of either doped polysilicon or a chosen metallic silicide, such as titanium silicide, tungsten silicide, tantalum silicide, or molybdenum silicide on the exposed silicon surfaces and any masking material remaining thereon. Thereafter, the layered structure is transferred to an electroplating bath wherein a layer of titanium is plated on the surfaces of the metallic silicide film using either an aqueous electroplating solution, a non-aqueous solution or a molten salt solution. Then, the structure is transferred to either an anneal furnace or to a rapid thermal processor (RTP) and heated to a predetermined elevated temperature for a predetermined time in the presence of nitrogen, using either nitrogen gas, N.sub.2, or ammonia, NH.sub.

Abstract: A lamp control module including a housing having a receptacle therein with a transformer winding wound around the inner walls of the receptacle in being operatively driven by a programmed microprocessor. The transformer winding of the module is further operative to be inductively coupled to a second transformer winding which is located within an on-off switch knob of a wall switch panel, and the second transformer winding is further connected to the gate electrode of an AC switch. Pulses which are generated in the lamp control module and controlled by data values stored in the microprocessor therein are transformer coupled from the housing receptacle transformer winding into the knob switch transformer and then to the gate electrode of the AC switch. These pulses are operative to control the phase angle and conduction time of the Triac and in turn control the conduction time that an AC voltage is applied from an external AC voltage source to a lamp.

Abstract: A new and improved tool for rapidly removing sealed covers from large paint buckets, oil buckets, and the like and comprising a handle having a hammer member affixed to one end thereof and a hook member extending away from the handle at a predetermined angle. The hook member has a slot therein defining a pair of hook ends, and a cutting blade member is located in the slot and is joined to the hook member. The blade member has a cutting edge of the same general contour as that of the pair of hook ends, and the blade member is thus partially protected from exposure to users during both transport and operation. A first upward torquing motion of the tool member is used to pull the cutting edge of the blade through slots or grooves in the edge of the lid being removed, whereas a second upward torquing motion of the tool is made after the lid edge has been inserted between the end of the cutting blade and a pair of hook ends located on each side thereof.

Abstract: A method for utilizing a single series operating current for providing operating power to an electronic device and adjacent cooling therefor while simultaneously increasing or decreasing the cooling in a manner directly proportional to increases and decreases in power consumption and heat dissipation from the electronic device. The electronic device is connected to a first power supply terminal and a Peltier cooling junction is connected to one side of the electronic device. A Peltier heating junction is connected to one side of the Peltier cooling junction remote from the electronic device, and a heat sink is connected between the Peltier heating junction and a second power supply terminal. In this manner, a single series electrical circuit may be used for simultaneously providing operating power to the electronic device and cooling the electronic device in proportion to heat dissipation requirements therefor.

Abstract: A process for depositing titanium nitride films on silicon substrates or the like which includes reacting nitrogen trifluoride, NF.sub.3, with a titanium containing reactant gas, such as a titanium containing metal organic precursor, in a low pressure chemical vapor deposition reaction chamber. This CVD chamber is preferably a single wafer chamber operated at a pressure between 0.1 and 10.0 Torr and at a elevated temperature on the order of about 500.degree. C. This process is most useful, for example, in the formation of low resistivity, highly conformal coatings of TiN on the surfaces of vias etched vertically in silicon integrated circuits and adapted to receive a selected heavy metal such as tungsten in direct contact therewith.

Abstract: A method and system for controlling the depth of removal by polishing of a selected material on a supporting underlayer where it is desired to terminate removal of the selected material, such as tungsten, at the material-underlayer interface. In accordance with this novel method and system, the selected material such as a surface metallization layer is polished to initiate removal thereof in the direction of the material-underlayer interface. A microphone is positioned at a predetermined distance from the wafer to sense acoustical waves generated when the depth of material removal reaches a certain determinable distance from the interface to thereby generate output detection signals. These output detection signals are amplified and then applied to a spectrum analyzer which operates to analyze the sound intensity-versus-frequency characteristic of the acoustical waves received by the microphone.

Abstract: Extraneous and undesirable particulate matter is suppressed in a reaction chamber for treating semiconductor materials by depositing a thin layer of polymeric or equivalent insulating material over the entire interior surfaces of the reaction chamber prior to any treatment therein of semiconductor wafers or the like. This process is repeated as necessary after the initial treatment of the wafers has begun, and this treatment will typically include the layer deposition and layer etching on the surfaces of the semiconductor wafers. The periodic intervals between subsequent polymer layer deposition within the reaction chamber is selected in proportion to measured etch or deposition rates therein to thereby optimize the stability and uniformity of these etch and deposition rates, while simultaneously maintaining a maximum degree of cleanliness within the reaction chamber and minimizing down time therefor.

Abstract: A new and improved electronic control module (ECM) for controlling lighting functions of an incandescent light bulb and method of manufacturing the ECM. The ECM is installed, such as by press fitting into a dielectric insulating material at the socket end of the bulb, after the high temperature bulb fabrication steps have been completed. In this manner, the solid state and associated circuitry of the electronic control module are not subjected to the high temperature processing used in lamp bulb fabrication. The electronic control module is especially well suited and adapted for integration into the lamp bulb housing and is constructed using a minimum number of reliably constructed and connected electrical components in a hybrid-type circuit module assembly which is economical to manufacture.

Abstract: A process for making vertical electrical interconnections in a variety of integrated circuits and novel IC structures produced thereby wherein buried conductors are provided within a dielectric layer located above a silicon substrate having active or passive devices formed therein. Internal edges of only one or selected ones of the conductors are provided with an insulating coating, so that an adjacent via may be filled with a conductive material and still be electrically isolated from the one conductor or conductors. One or more vias are etched directly through the other buried conductor or conductors and also filled with a conductive material which electrically connects this buried conductor or conductors to both the substrate and to an upper level of metallization, and alternatively to intermediate conductors or other components.

Abstract: A steering knuckle for operation in the front wheel base of a motor vehicle wherein the rotational pivot point for the spindle of the steering knuckle is extended by a predetermined ball joint arm length R.sub.E, thereby increasing the arc length in radians that the spindle will move in response to a given force applied to the tie rod arm of the steering knuckle. In this manner, the time that the tire surface of a wheel is in contact with the surface of a road during the time that the vehicle is making a turn is minimized, and this in turn minimizes the tire wear for the vehicle by reducing the forces of sliding friction received by the surface of the tire during vehicle turns.

Abstract: A method and apparatus for rapidly and reliably sealing off a selected exit way or entrance way from an adjacent path of smoke which comprises providing a reel of fire resistant material and having magnetic edge strips on each side thereof above said exit way or entrance way, and causing the reel to drop in vertical fall adjacent to the exit way or entrance way and simultaneously cause magnetized strips on a fire retardant curtain wound on the reel to become rapidly and magnetically attached to the exit way or entrance way upon the nearby condition of either smoke or fire. This apparatus is elegantly simple and reliable in both its construction and operation and has an extremely high price/performance figure of merit.

Abstract: A floating digital display thermometer for a hot tub, spa or swimming pool, having a motion-sensitive switch responsive to wave action or intentional manipulation. The components are arranged within a watertight housing to ensure that a digital display always remains up to ensure easy viewing. Circuitry is provided for converting temperature readings to a digital display, and for indicating other functions such as time and date, and for providing alarm and music capabilities. Manually-activated membrane switches may be provided to activate various functions of the device. Furthermore, the thermometer is also capable of measuring and displaying the PH and the oxidation reduction potential of the liquid in the spa or swimming pool.

Abstract: A system and method for minimizing power consumption in personal computers and for controlling the power requirements of a random access memory based upon the actual RAM requirements of given software application. Using this method and system, a predetermined number of rows of RAM storage capacity may be refreshed at any given time and at a controlled refresh frequency after a central processing unit has read a given software program to determine its data storage requirements. A novel RAM control system is connected between the output of the central processing unit and one or more inputs to the RAM storage stage and is operative in a novel manner to generate RAM row refresh signals to only a selected number of rows of memory cells within the random access memory stage.

Abstract: A solid state control circuit operative for connection to existing low-voltage thermostat terminals of a central, forced-air, air-conditioning system having a compressor and an indoor blower (referred to herein as a "fan") and gas-fired or electrical heating elements. Automatic means is provided for starting the blower simultaneously when the compressor or electric heating elements are turned on, but the blower continues to run by a timer for a predetermined timed period after the compressor is stopped, during cooling and heat pump heating, and is stopped simultaneously when the heating elements are turned off during electric heating. The control circuit is automatically inoperative with gas heat, since the blower in gas heating systems is controlled by a separate plenum thermostat which introduces start and stop delays independent of the room thermostat.

Abstract: An incandescent light bulb or the like and process for manufacturing same wherein an electronic control module (ECM) is installed, such as by press fitting into a dielectric insulating material at the socket end of the bulb, after the high temperature bulb fabrication steps have been completed. In this manner, the solid state and associated circuitry of the electronic contorl module are not subjected to the high temperature processing used in lamp bulb fabrication. The electronic control module is especially well suited and adapted for integration into the lamp bulb housing and is constructed using a minimum number of reliably constructed and connected electrical components in a hybrid-type circuit module assembly which is economical to manufacture.