Abstract: This invention relates to the area of microelectromechanical systems in which electronic circuits and mechanical devices are integrated on the same silicon chip. The method taught herein allows the fabrication of thin film structures in excess of 150 microns in height using thin film deposition processes. Wafers may be employed as reusable molds for efficient production of such structures.

Abstract: A method of fabricating a microstructure is disclosed. The method includes providing a substrate for forming an interface region and an elongated portion extending away from the interface region. A patterned, non-planar etchable structure is formed on one side of the elongated portion of the substrate. An unetchable membrane layer is deposited atop the etchable structure. At least one etching hole is formed in the membrane layer. The etchable structure is etched by placing an etchant into the etching hole to form a cavity underneath the membrane layer, thereby producing a shaft.

Abstract: A rotatable magnetron cathode having at least one supported end adapted for attachment to a spindle. At least one dark space shield is attached to the cathode at a supported end to rotate therewith, and is electrically floating relative to the cathode. If the cathode is cantilever mounted, a floating cone end shield, facing away from the gas discharge and not overlapping the cylindrical cathode wall, is used at the free end.