Abstract: A time stamping method for threshold crossing points of an input signal uses a dithered threshold level. Digital data samples are acquired for the input signal and time marks are determined for the threshold crossings using interpolation. The time marks are stores as the time stamps. A threshold offset value generator generates a distribution of offset values for dithering the threshold value. Time interval values are generated from the time stamps and the number of occurrences of time interval values are accumulated in time bins. A time interval distribution histogram and statistical time interval distribution data, such as the mean, standard deviation and minimum and maximum time intervals may be generated.

Abstract: A low capacitance probe tip and socket for a measurement probe has a probe tip extending through an insulating plug and a recess defining a socket formed in the plug. The socket has an aperture formed therein that provides access the low capacitance probe tip. An electrically conductive contact is disposed in the aperture that extends into the socket and is in electrical contact with the low capacitance probe tip. In one embodiment, the socket is formed parallel to the low capacitance probe tip. In a further embodiment, the socket is formed at an angle to the low capacitance probe tip with the electrically conductive contact being an electrically conductive elastomeric material disposed at the distal end of the socket in electrical contact with the low capacitance probe tip.

Abstract: The time stamping method for an input signal generates time marked digital data values as a reference edge and defines at least a first time stamp in the reference edge. Digital data samples of the input signal are acquired to create a waveform record of the input signal. The digital data samples of a waveform record edge are compared to time equivalent digital data values of the reference edge to generate a error value representative of the difference between the waveform record edge and the reference edge. A time offset value is generated from the error value to vary the time location of the reference edge and the comparison and time offset generating steps are repeated to minimize the error value. The time offset value at the minimum error value is combined with a time location of nearest digital data sample of the waveform record edge to generate a waveform record edge time stamp.

Abstract: A method of calibrating a timebase in a digitizing instrument estimates the frequency of the clock signal from the clock generator that clocks a coarse delay counter in a strobe generator. The dynamic range of the interpolator in the strobe generator is defined in digital-to-analog converter code values as a function of the clock signal period. A linear horizontal look-up table of equally spaced digital-to-analog converter code values is generated over the defined dynamic range of the interpolator. Residual nonlinearities of the interpolator over the defined dynamic range of the interpolator are characterized and scaled to digital-to-analog converter code values. The digital-to-analog converter code values of the characterized residual anomalies are combined with the digital-to-analog converter code values of the linear horizontal look-up table to generate a horizontal look-up table having DAC code value compensating for the nonlinearities of the interpolator.

Abstract: A method of mounting a banana-type electrical receptacle on the substrate includes the steps of placing the electrical receptacle over an aperture formed in the substrate with support ribs formed on the outer surface of the receptacle supporting the receptacle over the aperture. A deformable electrical lead extends from a centrally disposed conductive member making an electrical connection with an electrical contact on the substrate. The electrical lead is affixed to the electrical contact on the substrate and the receptacle is inserted into the aperture crushing or shearing the support ribs and the deforming the electrical lead. Alignment ribs formed on the outer surface of the receptacle have shoulders that contact the substrate for positioning the receptacle in the substrate. The mounting method is compatible with automated soldering processes, such as wave flow soldering.

Abstract: A bandpass sampling system (10) of this invention employs a conventional mixer (14) driven by a frequency-tunable LO (16) to upconvert a signal frequency band to an IF frequency band that is above the signal frequency band. The IF frequency band is passed through an IF bandpass filter (18) to provide to subsequent digitization stages (20, 24) an IF bandpass range of signal frequency components. In this architecture, the IF bandpass filter acts as an anti-alias filter for the digitization stages. The LO frequency is selected to place the upconverted signal frequency band within the pass band of the IF bandpass filter. The resultant IF bandpass signal is sampled and digitized at a rate that is commensurate with the IF bandwidth, but typically much lower than the IF bandpass center frequency. Signal sampling is carried out by a sample-and-hold or a track-and-hold circuit (20), the output of which is applied to an ADC (24) that is clocked (22) at the same rate as the sampling circuit.

Abstract: An electrical signal interconnect assembly has first and second high speed coaxial interconnects with each interconnect having a male and female side. One of the male and female side of the first interconnect is floatably mounted on the assembly with the other side mounted on an electrical instrument. The second coaxial interconnect is mounted on a mechanical alignment facility having coarse and fine mechanical alignment portions with the coarse mechanical alignment portion including a closely mating pocket and body. One of the male and female side of the interconnect is mounted on the pocket with the other side mounted on the body. One of the pocket and body is mounted on the interconnect assembly and the other of the pocket and body is mounted on the electrical instrument. A coaxial cable electrically connects the two coaxial interconnects together in the interconnect assembly.

Abstract: A low temperature co-fired ceramic substrate structure has first and second conductive patterns respectively disposed on first and second dielectric layers with the conductive patterns being separated by the first dielectric layer. The first conductive pattern has a first conductive element functioning as a first plate of a capacitor and a second conductive element functioning as a voltage potential lead for an integrated circuit device. The second conductive pattern is positioned below the first conductive pattern and functions as the second plate of the capacitor and as a thermally conductive heat transfer layer for the integrated circuit device. At least a first thermally conductive via is formed between the top and bottom surfaces of the second dielectric layer and below the second conductive element with the via thermally coupled to the second conductive pattern. The thermal via or vias may be thermally coupled to a heat sink disposed adjacent to the bottom surface of the second dielectric layer.

Abstract: An electronic interconnect adapter for a bulkhead mounted high speed coaxial interconnect has a rotatable coupling bushing with a central bore. One side of the bushing has an axially extending flange disposed around the bore with the flange having a threaded interior surface that threadably mates with a threaded exterior surface of the female side of the coaxial interconnect. The opposite side of the bushing has an axially disposed cavity with a diameter greater than the central bore forming a shoulder within the cavity. A male side of the interconnect has a flange radially extending from a shield contact with a mating member extending through bore. A radial slot is formed in the cavity adjacent to the shoulder that receives a retaining member that captures the flange between the shoulder and the retaining member to secure the male side of the high speed coaxial interconnect to the coupling bushing.

Abstract: A replaceable probe tip holder for an associated low capacitance probe head has a cap with a series of cavities formed therein and a bore extending from the inter most cavity to the front end of the cap. A first cavity receives the probe head tubular housing, a second cavity receives a portion of the probe head substrate extending from the housing, and a third cavity receives a first resilient compression member and a first electrically conductive probing tip having a shank and a head. The head is disposed in the third cavity in contact with the first resilient compression member and shank extends through the bore with the end of the shank extending from the front end of the cap. Attachment arms extend from the back end of the cap and are positionable on the outside of the housing. The replaceable probe tip holder may also be configured with differential probing tips having two electrically conductive probing tips extending from the cap.

Abstract: An attachable/detachable probe point for use with an electrical measurement probe includes a base having a aperture formed therein that extends through the base. An electrically conductive probing contact having at least a partially threaded body member and a pointed contact member is disposed in the aperture with a portion of the body member extending from the top surface of the base and the pointed contact member extendable from a first position within the aperture to a second protruding position outside the aperture at the bottom surface of the base. A compliant adhesive material formed on the bottom surface of the base for securing the attachable/detachable probe point to probing contact point.

Abstract: An adapter for a multi-channel signal probe has one of the mating plug or receptacle portions of the connector electrically coupled to a first array of contact pads on one surface of a substrate. A second array of contact pads corresponding to the signal contact pads on a device under test is formed on the other surface of the substrate. A removable signal contact holder supports electrically conductive elastomer signal contacts that couple the second array of contact pads to the signal contact pads of the device under test. The adapter is secured to the device under test using an adapter retention member that is positioned on the opposite of the circuit board from the signal contact pads. Screws attach the retention member to the adapter via through holes formed in the device under test.

Abstract: A frequency spectrum measurement apparatus sweeps a desired frequency range using multiple scan lines. A controller provides a non-contiguous sequence of input values to a frequency synthesizer operating as a local oscillator for generating a non-contiguous frequency output signal over the desired frequency range with each value offsetting a current frequency output signal from a previous frequency output signal. A mixer receives an input signal and the variable frequency synthesizer signal for generating an intermediate frequency signal that is filtered through a bandpass filter. The power of the intermediate frequency signal output of the bandpass filter is measured and displayed. The frequency spectrum measurement apparatus is usable in measuring out of channel emissions of a terrestrial RF broadcast digital television signal.

Abstract: A phase stable clock circuit includes a phase gate having track-and-hold (T/H) circuits with each T/H circuit receiving a phase shifted continuous sinusoidal signal of predetermined phase and a control input signal to capture and hold phase samples of the sinusoidal signals. In alternative embodiments, a phase correction circuit provides phase correction values that are added to the held phase values to generate corrected phase values and time-error phase lookup table is used to generate time position correction values. The corrected phase values are applied to the phase gate remove deterministic phase errors to generate an output signal with a predetermined startup phase relative to the control input signal transition. The phase error-to-time lookup table adjusts the time placement of waveform record samples after the acquisition of the samples.

Abstract: A variable spacing probe tip adapter for a differential measurement probe has a measurement probe head with first and second probe tips extending from the probe head. Ribs and grooves formed in the probe head that extend radially from around each of the probe tips. Each of first and second first probing tips have an electrically conductive shaft that has a bore formed in one end for engaging the probe tips of the measurement probe. Each shaft has ribs and grooves formed therein that extend radially from the bore for engaging the corresponding grooves and ribs in the probe head. The other end of the conductive shaft tapers to a probing point with and a portion of the shaft toward the tapered end of the shaft being angled such that the probing tips. The conductive shafts are rotatable on measurement probe tips and locked into position by the engagement of the ribs and grooves in the probe head and the probing tips.

Abstract: An adapter for an electronic interconnect assembly has a high speed coaxial interconnect for a coaxial transmission line having a central signal conductor and a surrounding shield conductor. The coaxial interconnect has a male side and a female side, with the female side including a shield sleeve having a chamber that receives a male shield contact on the male side. The shield sleeve has a contact with a compliant portion that flexibly grips the male shield contact. A mechanical alignment facility portion selected from a pair of alignment facility portions including a closely mating pocket and body has one of the male side or female side of the coaxial interconnect. An electrical signal connector is electrically coupled to the selected male or female of the coaxial interconnect.

Abstract: An electronic interconnect assembly has a high speed coaxial interconnect for a coaxial transmission line having a central signal conductor and a surrounding shield conductor. The coaxial interconnect has a male side and a female side, with the female side including a shield sleeve having a chamber that receives a male shield contact on the male side. The shield sleeve has a contact with a compliant portion that flexibly grips the male shield contact. A mechanical alignment facility includes a closely mating pocket and body, each attached to a respective male or female side of the interconnect. Additional data and power connectors may be included with the pocket and body.