Patents Represented by Attorney William K. Konard

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  • Method of reducing generation of particulate matter in a sputtering chamber
    Patent number: 5961793
    Abstract: An RF coil for a plasma chamber in a semiconductor fabrication system is conditioned to reduce shedding of particulate matter onto the workpiece. In the illustrated embodiment, the coil is sputtered prior to sputtering the target so as to remove oxides and other contaminants from the surface of the coil. As a result, shedding of particulate matter from target material subsequently deposited onto the coil is reduced.
    Type: Grant
    Filed: October 31, 1996
    Date of Patent: October 5, 1999
    Assignee: Applied Materials, Inc.
    Inventor: Kenny K. Ngan