Abstract: A method of etching a substrate and an article(s) formed using the method are provided. The method includes providing a substrate; coating a region of the substrate with a temporary material having properties that enable the temporary material to remain substantially intact during subsequent processing and enable the temporary material to be removed by a subsequent process that allows the substrate to remain substantially unaltered; removing a portion of the substrate to form a feature, at least some of the removed portion of the substrate overlapping at least a portion of the coated region of the substrate while allowing the temporary material substantially intact; and removing the temporary material while allowing the substrate to remain substantially unaltered.
Type:
Grant
Filed:
August 4, 2004
Date of Patent:
April 8, 2008
Assignee:
Eastman Kodak Company
Inventors:
Gary A. Kneezel, John A. Lebens, Christopher N. Delametter, David P. Trauernicht, James M. Chwalek