Abstract: A capacity increase and/or pressure decrease of gas in a gas storage and dispensing vessel is achieved by use of a physical adsorbent having sorptive affinity for the gas. Such approach enables conventional high pressure gas cylinders to be redeployed with contained sorbent, to achieve substantial enhancement of safety and capacity.

Abstract: A boule formed by high rate vapor phase growth of Group III-V nitride boules (ingots) on native nitride seeds, from which wafers may be derived for fabrication of microelectronic device structures. The boule is of microelectronic device quality, e.g., having a transverse dimension greater than 1 centimeter, a length greater than 1 millimeter, and a top surface defect density of less than 107 defects cm−2. The Group III-V nitride boule may be formed by growing a Group III-V nitride material on a corresponding native Group III-V nitride seed crystal by vapor phase epitaxy at a growth rate above 20 micrometers per hour.

Abstract: The present invention provides a hydrogen sensor including a thin film sensor element formed by metal organic chemical vapor deposition (MOCVD) or physical vapor deposition (PVD), on a micro-hotplate structure. The thin film sensor element includes a film of a hydrogen-interactive metal film that reversibly interacts with hydrogen to provide a correspondingly altered response characteristic, such as optical transmissivity, electrical conductance, electrical resistance, electrical capacitance, magneto resistance, photoconductivity, etc., relative to the response characteristic of the film in the absence of hydrogen. The hydrogen-interactive metal film may be overcoated with a thin film hydrogen-permeable barrier layer to protect the hydrogen-interactive film from deleterious interaction with non-hydrogen species. The hydrogen permeable barrier may comprise species to scavenge oxygen and other like species.

Abstract: An improved double chamber ion source comprising a plasma generating chamber, a charge exchange chamber and a divider structure therebetween. The charge exchange chamber includes magnetic shielding material to reduce exposure of interior components to magnetic field lines externally generated. The double compartment ion source further comprises inclusion of a heat shield and/or a cooling system to overcome deleterious effects caused by increased temperature in the plasma generating chamber. The divider structure has a plurality of apertures having a configuration to reduce surface area on the divider structure in the charge exchange chamber.

Abstract: The present invention provides a reaction chamber cleaning apparatus comprising a chamber, a blade apparatus comprising at least one annular mounting member, at least four scraping blades attached peripherally about the annular mounting member, and a reciprocal movement unit for rotating said scraping blade(s) circumferentially back and forth along the interior surface of said chamber to scrape the interior surface of said chamber; said reaction chamber cleaning apparatus also comprising a vortex unit comprising a generally conical outer shell attached to and extending downwardly from the top plate top plate, and a liquid inlet arranged in relation to the outer shell to tangentially introduce liquid into the outer shell, thereby forming a laminar sheet of fluid on the inner surface of the outer shell; said vortex unit further comprising a baffle and a concentric chamber bounded by the outer surface of the baffle, the inner surface of the outer shell, and the bottom surface of the top plate.

Abstract: In a first respect this invention is a container, comprising: a cylindrical, hollow body capped on both ends by a base and a top; a conduit that bisects the top and extends into the interior of the container; and a perforated housing that encompasses the portion of the conduit that extends into the interior of the container. In another broad respect, this invention is a removable splash guard, comprising: a housing having a top and bottom that define an internal space; a lower tube that bisects the bottom, wherein the lower tube has a upper portion which is angled; an upper tube that bisects the top, wherein a portion of the second tube that extends into the internal space contains at least one hole; and a partition interposed between the upper and lower tubes that serves to block movement of a chemical from the lower tube to the opening at the inboard end of the upper tube.

Abstract: An air manager and/or chemical containment apparatus, for environmental control of fumes from wet bench units of semiconductor manufacturing facilities. The air manager system is suitable for installation in an open architecture wet bench or an enclosed mini-environment wet bench, and includes an air source and an air exhaust arranged for flowing air across an open chemical tank, to entrain fumes from chemical in the tank that otherwise may migrate from the immediate vicinity of the tank, and transport such fumes to the exhaust with the air flowed from the air source to the exhaust.

Abstract: A semiconductor substrate processing system, including a single wafer reactor and a multi-wafer holder positionable in the reactor. The system also optionally includes an automated substrate transport assembly including a multi-wand array for transporting a corresponding plurality of wafers into and out of the reactor, and a multi-wafer cassette for simultaneously supplying multiple wafers to the multi-wand array. The multi-wafer modifications permit ready upgradeability to an existing single wafer reactor and markedly enhance the throughput capacity of the reactor while retaining the film uniformity and deposition process control advantages of the single wafer reactor system.

Abstract: An apparatus and method for the indirect determination of concentrations of additives in metal plating electrolyte solutions, particularly organic additives in Cu-metalization baths for semiconductor manufacturing. The apparatus features a reference electrode housed in an electrically isolated chamber and continuously immersed in the base metal plating solution (without the additive to be measured). An additive concentration determination method comprises electroplating a test electrode at a constant or known current in a mixing chamber wherein the base metal plating solution is mixed with small volumes of the sample and various calibration solutions containing the additive to be measured. Plating potentials between the electrodes are measured and plotted for each of the solution mixtures, and data are extrapolated to determine the concentration of the additive in the sample.

Abstract: A fluid containment system including a vessel for containing a fluid that is discharged from the vessel in use or operation of the system. A pressure monitoring assembly including a strain-responsive sensor is disposed on an exterior wall surface of the vessel, to sense dynamic strain on the wall surface of such vessel that is incident to discharge of fluid from the vessel, and to responsively output a pressure-indicative response. Such arrangement is particularly useful in application to fluid storage and dispensing vessels containing interiorly disposed pressure regulator assemblies and holding liquefied gases or compressed gases, e.g., for use in semiconductor manufacturing operations.

Abstract: An effluent abatement system for abating hydride species in a hydride-containing effluent, arranged for carrying out the steps of: (1) contacting the hydride-containing effluent with a dry scrubber material comprising a metal oxide that is reactive with the hydride species to remove the hydride species from the effluent, until the capacity of the dry scrubber material for hydride species is at least partially exhausted; and (2) contacting the at least partially exhausted capacity dry scrubber material with an oxidant to at least partially regain the capacity of the dry scrubber material for the hydride species. The system of the invention has particular utility in the treatment of effluent from III-V compound semiconductor manufacturing operations.

Abstract: A high quality wafer comprising AlxGayInzN, wherein 0<y≦1 and x+y+z=1, characterized by a root mean square surface roughness of less than 1 nm in a 10×10 &mgr;m2 area at its Ga-side. Such wafer is chemically mechanically polished (CMP) at its Ga-side, using a CMP slurry comprising abrasive particles, such as silica or alumina, and an acid or a base. The process of fabricating such high quality AlxGayInzN wafer may include steps of lapping, mechanical polishing, and reducing internal stress of said wafer by thermal annealing or chemical etching for further enhancement of its surface quality. The CMP process is usefully employed to highlight crystal defects on the Ga-side of the AlxGayInzN wafer.