Abstract: A method with three embodiments of manufacturing metal lines and solder bumps using electroless deposition techniques. The first embodiment uses a PdSix seed layer 50 for electroless deposition. The PdSix layer 50 does not require activation. A metal line is formed on a barrier layer 20 and an adhesion layer 30. A palladium silicide seed layer 50 is then formed and patterned. Ni, Pd or Cu is electroless deposited over the palladium silicide layer 50 to form a metal line. The second embodiment selectively electrolessly deposits metal 140 over an adhesion layer 130 composed of poly Si, Al, or Ti. A photoresist pattern 132 is formed over the adhesion layer. A metal layer 140 of Cu or Ni is electrolessly deposited over the adhesion layer. The photoresist layer 132 is removed and the exposed portion of the adhesion layer 130 and the underlying barrier metal layer 120 are etched thereby forming a metal line.