Patents Represented by Attorney, Agent or Law Firm Williams J. Sapone
  • Patent number: 6197858
    Abstract: The present invention relates to a polyamide resin composition comprising a polyamide resin, a modified ethylene copolymer, an amide-based dispersant and an electroconductive material, said composition having not more than 1011 &OHgr;·cm of an intrinsic volume resistivity and not less than 30 KJ/m2 of an Izod impact strength measured according to ASTM D256.
    Type: Grant
    Filed: December 21, 1998
    Date of Patent: March 6, 2001
    Assignees: Toyoda Goesi Co., Ltd, Mitsubishi Chemical Corp.
    Inventors: Hiroyuki Hagano, Masayuki Nakagawa, Hideyuki Hisashi, Seiji Morimoto