Abstract: The present invention relates to a polyamide resin composition comprising a polyamide resin, a modified ethylene copolymer, an amide-based dispersant and an electroconductive material,
said composition having not more than 1011 &OHgr;·cm of an intrinsic volume resistivity and not less than 30 KJ/m2 of an Izod impact strength measured according to ASTM D256.
Type:
Grant
Filed:
December 21, 1998
Date of Patent:
March 6, 2001
Assignees:
Toyoda Goesi Co., Ltd, Mitsubishi Chemical Corp.