Abstract: An adherent layer comprising elemental titanium, optionally in combination with another metal such as copper, is deposited on a substrate, preferably of alumina or aluminum nitride, and serves as a base for a further conductive coating which may be applied by electroless or electrolytic deposition. The adherent layer is applied by contacting the substrate with a mixture of the elemental metal(s) and a substantially anhydrous salt composition, preferably an equimolar mixture of potassium chloride and sodium chloride; heating at a temperature and for a time sufficient to melt said salt composition; and removing said salt composition, preferably by water washing.